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MAX8891EXK33+T is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC REG LINEAR 3.3V 150MA SC-70-6. Review the specifications below when checking this part for your BOM.
The MAX8891EXK33+T is a low-dropout linear regulator manufactured by Analog Devices Inc./Maxim Integrated. It provides a fixed output voltage of 3.3 V with a maximum output current of 150 mA. The device operates within an input voltage range of 2 V to 6 V and maintains a typical power supply rejection ratio of 65 dB. Quiescent current is specified at 40 uA, with a maximum dropout voltage of 120 mV. It functions reliably across a temperature range of -40 C to +85 C and utilizes a SC-70-5 surface-mount package.
Verify the specific suffix and tape-and-reel configuration during acquisition. Confirm that the component meets RoHS compliance standards required for your manufacturing process. Ensure the supplier provides valid traceability documentation. Check for any regional distribution restrictions before finalizing orders. Validate the package type matches your PCB footprint requirements exactly.
Choose this regulator when a fixed 3.3 V rail is necessary for low-noise applications. Select it for designs requiring small form factors due to the compact SC-70-5 package. Consider its low quiescent current for extended battery life in portable equipment. Verify that the input voltage remains within the specified operational limits for optimal performance.
This component belongs to the MAX8891 series of ultra-low-power LDO regulators. The series is designed for portable electronics requiring high PSRR and low noise. It serves as a key power management element in mobile communication devices. The part integrates essential protection features for reliable standalone operation.
Consult official cross-reference lists for verified substitutes. Ensure replacement parts match the exact output voltage and current ratings. Verify package compatibility and pin-out alignment before integration.
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