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MAX9179EUE is listed in the Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC TRANSCEIVER 0/4 16TSSOP. Review the specifications below when checking this part for your BOM.
The MAX9179EUE is a quad low-voltage differential signaling (LVDS) receiver manufactured by Analog Devices Inc. under the Maxim Integrated brand. It supports data rates up to 400 Mb/s and features a 50mV receiver hysteresis for noise immunity. The device operates from a single 3V to 3.6V power supply and utilizes an LVCMOS output type. Packaged in a 16-TSSOP surface-mount case, it functions within a temperature range of -40°C to +85°C.
Verify that the specific part number matches the required operating temperature range and package configuration. Confirm that the supplier provides documentation confirming the component is from the authorized manufacturer or authorized distributor channels. Ensure the received units are free from physical damage and match the specified 16-TSSOP footprint dimensions before integration into the design.
Select this component when a design requires multiple LVDS inputs without the need for integrated drivers. The fixed 50mV hysteresis value is suitable for standard LVDS environments but may require evaluation if the application involves significantly higher noise floors. Consider the 16-TSSOP package constraints regarding thermal dissipation and board space availability compared to alternative packages.
This component belongs to the family of LVDS interface receivers designed for high-speed digital communication. It complements driver components to form complete differential signaling links. The E suffix typically denotes the industrial temperature grade variant, distinguishing it from commercial or extended temperature options available within the broader product line.
Direct substitutes include other quad LVDS receivers with similar 400Mb/s speeds and 50mV hysteresis specifications. Verify pin-to-pin compatibility and electrical parameter alignment before substitution. Alternative packages such as TQFN may offer different thermal characteristics but require layout adjustments.
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