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Product Detailed Parameters
- Description：IC BUFFER LO 20-TQFN
- Series：-
- Mfr：Analog Devices Inc./Maxim Integrated
- Package：Tray,Tray
- Function：LO Buffers
- Frequency：700MHz ~ 1.1GHz
- RF Type：Cellular, GSM
- Secondary Attributes：40dB Reverse Isolation
- Mounting Type：Surface Mount
- Package / Case：20-WQFN Exposed Pad
- Supplier Device Package：20-TQFN (5x5)
- Grade：-
- Qualification：-
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Overview
The MAX9989ETP is a radio frequency integrated circuit designed as a local oscillator buffer and splitter. It operates within a frequency range of 700MHz to 1.1GHz, targeting cellular and GSM applications. The device provides an output power level between 14dBm and 20dBm. Key electrical characteristics include 40dB reverse isolation, ensuring signal integrity in RF front-end architectures.
Feature Summary
- Functions as a local oscillator buffer and splitter for RF signal distribution
- Provides high reverse isolation to prevent signal feedback
- Optimized for cellular and GSM communication system architectures
Applications
- Cellular base station local oscillator distribution
- GSM transceiver LO buffering
- RF front-end signal splitting
Procurement Notes
Verify the specific suffix (e.g., +T) against the official datasheet to confirm package type and tape-and-reel specifications. Confirm current product status, as availability may vary by region or distributor. Ensure the selected variant matches the required operating temperature range and voltage supply constraints for the target design.
Selection Notes
Select this component when designing RF chains requiring buffered LO signals for cellular bands. Evaluate the 14dBm to 20dBm output capability against downstream mixer or amplifier input requirements. Consider the 40dB reverse isolation specification for systems sensitive to LO leakage or feedback interference.
Part Context
This part belongs to the Analog Devices Maxim Integrated portfolio of RF integrated circuits. It is categorized under wireless and RF ICs, specifically serving as a buffer/splitter solution. The device supports standard surface-mount packaging suitable for automated assembly in consumer and industrial electronics manufacturing.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing board layouts and impedance matching networks if considering alternative RF buffer solutions.
