MB85AS8MTPWG-KBCERE1

Memory IC Overview

The MB85AS8MTPWG-KBCERE1 is an 8 Mbit ReRAM device with a 1,048,576 x 8-bit configuration. It utilizes SPI interface supporting modes 0 and 3 at up to 10 MHz. Operating voltage ranges from 1.6 V to 3.6 V. Endurance is 1x10^6 cycles/4 bytes; retention is 10 years at +85°C. Package is 11-pin WLP Type-C.

Memory IC Feature Summary

• Resistive Random Access Memory technology for nonvolatile data storage without backup batteries
• Serial Peripheral Interface (SPI) communication compatible with standard microcontrollers
• Integrated write buffer allowing sequential data writes up to 256 bytes per cycle
• Low power consumption with dedicated sleep mode for extended battery life

Memory IC Applications

• Data logging in industrial equipment requiring frequent updates
• Configuration storage in embedded systems
• Firmware storage in IoT devices
• Automotive sensor data recording

Memory IC Procurement Notes

Verify the specific package variant (Type-A, B, or C) matches your PCB footprint requirements. Confirm the ordering suffix aligns with the required shipping form. Ensure design compliance with the specified operating temperature range and voltage limits.

Memory IC Selection Notes

Select this component when high endurance is required for frequent data rewriting. The SPI interface simplifies integration with existing controllers. Consider the small WLP package size for space-constrained designs. Verify that the 10 MHz clock speed meets system timing requirements.

Memory IC Part Context

This part belongs to the MB85AS8MT series of ReRAM memory chips manufactured by RAMXEED. It represents a transition from Fujitsu Semiconductor's product line while maintaining identical specifications and pinouts. The series focuses on high-endurance nonvolatile memory solutions.

Memory IC Replacement Considerations

Direct replacements include other MB85AS8MT variants with different package types (Type-A or Type-B). Cross-vendor alternatives require verification of SPI command compatibility and physical footprint dimensions.