MB85R256FPF-G-BND-ERE1

Description：IC FRAM 256KBIT PARALLEL 28SOP
Series：-
Mfr：RAMXEED
Package：Tape & Reel (TR)

SKU:b6712ab614e6 Category: Memory IC Brand: RAMXEED

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Product introduction

MB85R256FPF-G-BND-ERE1 is listed in the Memory IC range at ChipApex. The manufacturer field lists RAMXEED. Its product description is IC FRAM 256KBIT PARALLEL 28SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MB85R256FPF-G-BND-ERE1

Description：IC FRAM 256KBIT PARALLEL 28SOP
Series：-
Mfr：RAMXEED
Package：Tape & Reel (TR)
Memory Type：Non-Volatile
Memory Format：FRAM
Technology：FRAM (Ferroelectric RAM)
Memory Size：256Kbit
Memory Organization：32K x 8
Memory Interface：Parallel
Clock Frequency：-
Write Cycle Time - Word, Page：150ns
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：28-SOIC (0.295", 7.50mm Width)
Supplier Device Package：28-SOP
Access Time：150 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for MB85R256FPF-G-BND-ERE1

MB85R256FPF-G-BND-ERE1

Memory IC Overview

The MB85R256FPF-G-BND-ERE1 is a non-volatile ferroelectric RAM (FeRAM) integrated circuit manufactured by RAMXEED. It provides a storage capacity of 256 kbit, organized as 32k x 8 bits. The device utilizes a parallel interface and is housed in a 28-SOP package with dimensions of 0.295 inches (7.50mm) width. It operates within a supply voltage range of 2.7V to 3.6V and supports an operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

Non-volatile data retention capability inherent to ferroelectric memory technology
Parallel interface architecture for direct bus connectivity
Surface-mount packaging suitable for automated assembly processes

Memory IC Applications

Industrial control systems requiring reliable data logging
Automotive electronics operating under standard temperature conditions
Embedded systems needing fast random access memory replacement

Memory IC Procurement Notes

Verify the specific suffix BND against official datasheets to confirm the 28-SOP package variant. Ensure compatibility with existing parallel bus designs. Confirm moisture sensitivity level requirements for your manufacturing process. Check for any product change notifications regarding recent revisions. Validate that the 2.7V to 3.6V supply range matches your system power rails.

Memory IC Selection Notes

Select this component when a parallel interface is required instead of serial alternatives like SPI or I2C. The 256 kbit density suits applications needing moderate storage without complex addressing schemes. Consider the 28-pin footprint for PCB layout constraints. Verify thermal performance within the specified -40°C to +85°C range for your environment.

Memory IC Part Context

This part belongs to the MB85R256 family of FeRAM devices. It shares core memory technology with other variants but differs in interface type and package. Parallel interfaces offer higher throughput potential compared to serial options but require more pins. The 28-SOP form factor distinguishes it from smaller 8-pin serial counterparts.