MB85RS2MTAPNF-G-AWERE2

Memory IC Overview

The MB85RS2MTAPNF-G-AWERE2 is a 2 Mbit (262,144 words x 8 bits) Ferroelectric Random Access Memory (FeRAM) integrated circuit manufactured by RAMXEED. It utilizes the Serial Peripheral Interface (SPI) for communication and supports SPI modes 0 and 3 with a maximum operating frequency of 40 MHz. The device operates within a supply voltage range of 1.7 V to 3.6 V and functions across an ambient temperature range of -40°C to +85°C. It is housed in an 8-pin plastic SOP package.

Memory IC Feature Summary

• High endurance capability supporting up to 10^13 read/write operations per byte without requiring wait time during write cycles.
• Nonvolatile data retention lasting up to 10 years at +85°C or 95 years at +55°C, eliminating the need for backup batteries.
• Integrated block protection and write protect mechanisms controlled via status register bits and hardware pins.

Memory IC Applications

• Data logging systems requiring frequent real-time writes
• Industrial metering and measurement instruments
• Automotive information recording modules

Memory IC Procurement Notes

Verify the specific ordering suffix AWERE2 corresponds to the embossed carrier tape shipping form with a minimum quantity of 1500 units. Confirm that the 150mil lead pitch SOP package dimensions match the target PCB footprint. Ensure the design accounts for Moisture Sensitivity Level 3 requirements regarding floor life and reflow soldering conditions.

Memory IC Selection Notes

Select this component when high-speed serial access is required alongside extreme write endurance. The 40 MHz SPI interface allows for faster data throughput compared to lower-frequency alternatives. The wide operating voltage range facilitates integration into various power domains without level shifting complexities.

Memory IC Part Context

This part belongs to the MB85RS2MTA family of FeRAM devices from RAMXEED, formerly Fujitsu Semiconductor. The manufacturer transitioned its name while maintaining existing part numbers and product support structures. This specific variant represents the tape-and-reel packaging option for automated surface-mount assembly processes.

Memory IC Replacement Considerations

MB85RS2MTAPNF-G-BDERE1