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MBR600150CT is listed in the Diode Arrays range at ChipApex. The manufacturer field lists GeneSiC Semiconductor. Its product description is DIODE MOD SCHOT 150V 300A 2TOWER. Review the specifications below when checking this part for your BOM.
The GeneSiC Semiconductor MBR600150CT is a silicon power Schottky diode module rated for a repetitive peak reverse voltage of 150 V and an average forward current of 600 A per package. It features a twin tower screw-mount configuration with a maximum forward voltage of 0.88 V at 300 A. The device supports a peak forward surge current of 4000 A and operates within a junction temperature range of -55 °C to +150 °C.
Verify the specific datasheet revision and terminal configuration before ordering, as the manufacturer notes that devices marked with an "R" suffix have reversed leads. Confirm the exact voltage rating matches the system requirement, as this series spans from 150 V to 200 V. Ensure the mounting hardware is compatible with the twin tower screw-mount style specified in the mechanical dimensions.
Select this component when high current capacity and low forward voltage drop are critical for efficiency. The 150 V rating suits lower voltage DC bus applications compared to the 200 V variants in the same series. Consider the thermal resistance of 0.28 °C/W per leg when designing the heatsink interface to maintain the junction temperature within the specified 150 °C limit under continuous load conditions.
This part belongs to the MBR600150CT through MBR600200CTR series of silicon power Schottky diodes. These modules utilize a twin tower design to handle high currents while maintaining compact footprints. The series offers various voltage ratings, with the MBR600150CT specifically providing the 150 V blocking capability option for systems requiring this specific voltage headroom.
Cross-reference with other models in the MBR600150CT through MBR600200CTR series if different voltage ratings are needed. Verify lead orientation carefully, as "R" versions feature reversed terminals which may require PCB layout adjustments during substitution.
The thermal resistance from junction to case is 0.28 °C/W per leg.
No, the device is not ESD sensitive according to the official specifications.
The module can withstand a peak forward surge current of 4000 A for an 8.3 ms half-sine wave pulse.
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