Diode Arrays MBRB30H30CT-1G product image

MBRB30H30CT-1G

$0.77
  • Description:DIODE ARRAY SCHOTT 30V 15A TO262
  • Series:SWITCHMODE™

SKU:e445fe038e6c Category: Brand:

  
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MBRB30H30CT-1G is listed in the Diode Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is DIODE ARRAY SCHOTT 30V 15A TO262. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for MBRB30H30CT-1G

  • Description:DIODE ARRAY SCHOTT 30V 15A TO262
  • Series:SWITCHMODE™
  • Mfr:onsemi
  • Package:Bulk,Tube
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Schottky
  • Voltage - DC Reverse (Vr) (Max):30 V
  • Current - Average Rectified (Io) (per Diode):15A
  • Voltage - Forward (Vf) (Max) @ If:480 mV @ 15 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:800 µA @ 30 V
  • Operating Temperature - Junction:-55°C ~ 150°C
  • Mounting Type:Through Hole
  • Package / Case:TO-262-3 Long Leads, I2PAK, TO-262AA
  • Supplier Device Package:TO-262 (I2PAK)
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for MBRB30H30CT-1G

MBRB30H30CT-1G

Diode Arrays Overview

The MBRB30H30CT-1G is a silicon Schottky barrier rectifier manufactured by onsemi, designed for high-efficiency power conversion applications. It features a dual common cathode configuration housed in an I2PAK surface-mount package. The device supports a maximum repetitive reverse voltage of 30 V and provides a total average forward current rating of 30 A, with 15 A per diode leg. Key electrical characteristics include a low forward voltage drop of 620 mV at rated current and a peak non-repetitive surge current capability of 260 A. The component operates within a junction temperature range from -55 °C to +175 °C, ensuring reliability in demanding thermal environments.

Diode Arrays Feature Summary

  • Utilizes Schottky barrier technology to achieve low forward voltage drop and high switching efficiency.
  • Features a dual common cathode configuration suitable for full-wave rectification or synchronous rectification topologies.
  • Designed with high surge current capacity to withstand transient load conditions.

Diode Arrays Applications

  • DC-DC converter output rectification
  • Free-wheeling diodes in power supply circuits
  • Power management systems requiring low loss rectification

Diode Arrays Procurement Notes

Verify the specific suffix and marking against the official onsemi datasheet to confirm the 30 V rating and I2PAK package variant. Confirm RoHS compliance status through the manufacturer's material declaration. Check for obsolescence notices as older series components may be subject to phase-out schedules. Ensure the ordering part number matches the required lead frame finish and tape/reel or tube packaging format specified in the latest procurement documentation.

Diode Arrays Selection Notes

Select this component when a low forward voltage drop is critical for minimizing conduction losses in 30 A applications. The 30 V rating limits suitability to low-voltage DC bus systems. The I2PAK package offers a balance between thermal performance and PCB space constraints compared to larger through-hole options. Evaluate the thermal resistance requirements of the application to ensure adequate heat sinking for continuous 15 A per leg operation.

Diode Arrays Part Context

This device belongs to the SWITCHMODE H Series of Schottky rectifiers from onsemi, engineered for general-purpose power rectification. The series emphasizes high efficiency and ruggedness for industrial and consumer power supplies. The MBRB30H30CT-1G specifically addresses the need for reliable rectification in low-voltage, high-current architectures where standard PN junction diodes would incur excessive power dissipation.

Diode Arrays Replacement Considerations

Direct replacements must match the 30 V reverse voltage, 30 A total current, and I2PAK (TO-263) package outline. Verify that substitute parts maintain equivalent forward voltage and thermal characteristics. Cross-reference pinout configurations to ensure compatibility with existing PCB footprints.

MBRB30H30CT-1GMBRB30H30CT-1G
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