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MBRB750HE3_A/I is listed in the Single Diodes range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE SCHOTTKY 50V 7.5A TO263AB. Review the specifications below when checking this part for your BOM.
The MBRB750HE3_A/I is a Schottky barrier rectifier manufactured by Vishay General Semiconductor - Diodes Division. It features a 50V maximum repetitive reverse voltage and a 7.5A average forward rectified current rating. The device utilizes a TO-263AB (D2PAK) surface-mount package. Key electrical characteristics include a low forward voltage drop of 580mV at 3A and a maximum reverse leakage current of 500µA at 60V. It operates within a junction temperature range of -55°C to 150°C.
Verify the obsolete status of this specific part number before procurement planning. Confirm availability of direct or similar substitutes such as the V8P6HM3_A/I from the same manufacturer. Ensure that any replacement component matches the original electrical ratings, package dimensions, and thermal performance requirements for your specific design.
Select this component for applications requiring efficient rectification with low forward voltage characteristics. The TO-263AB package provides adequate thermal dissipation for moderate current loads. Consider the 50V reverse voltage rating when designing for systems with potential voltage spikes. Verify that the 7.5A current rating aligns with the peak and continuous load requirements of the target circuit.
This component belongs to Vishay's MBRB series of Schottky rectifiers. These devices are designed for general-purpose rectification in power electronics. The HE3 suffix indicates an eco-friendly planar die structure with improved thermal performance compared to standard equivalents. The I suffix typically denotes a specific tape and reel packaging configuration.
The MBRB750HE3_A/I is listed as obsolete. A similar substitute identified is the V8P6HM3_A/I. Verify that the substitute maintains equivalent voltage, current, and package specifications before integration.
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