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MBRD20100CTH-TP is listed in the Diode Arrays range at ChipApex. The manufacturer field lists MCC (Micro Commercial Components). Its product description is DIODE ARRAY SCHOTT 100V 20A DPAK. Review the specifications below when checking this part for your BOM.
The MBRD20100CTH-TP is a dual common cathode Schottky rectifier manufactured by Micro Commercial Components. It features a 100 V repetitive peak reverse voltage and a 20 A average forward current rating per diode. The device utilizes silicon technology in a DPAK (TO-252) surface-mount package. Key electrical characteristics include a maximum forward voltage of 800 mV at 10 A and a maximum reverse leakage current of 10 µA at 100 V. The component supports a junction temperature range from -55°C to +150°C.
Verify the specific suffix 'TH' against the manufacturer's latest datasheet to confirm tape-and-reel packaging specifications and pinout orientation. Ensure that the ordering information matches the exact voltage and current ratings required for the target circuit design. Cross-reference the RoHS compliance status with current environmental regulations before finalizing procurement orders.
Select this component when a dual Schottky arrangement is preferred over discrete single diodes to save board space. The TO-252 package offers a balance between thermal performance and mounting density. Compare the forward voltage and reverse leakage specifications against alternative manufacturers to ensure compatibility with existing thermal management designs and efficiency targets.
This part belongs to the MBRD series of dual Schottky rectifiers from Micro Commercial Components. The series is designed for general-purpose rectification in low-to-medium power applications. The 'TP' suffix typically indicates a specific packaging or compliance variant within the MCC portfolio, distinguishing it from bulk or other reel configurations.
Direct replacements must match the 100 V / 20 A dual common cathode specification. Verify that substitute parts offer equivalent forward voltage and thermal resistance values. Check for package compatibility with the existing PCB footprint to avoid mechanical redesign requirements.
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