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MBRD650CTTR is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE ARRAY SCHOTTKY 50V 3A DPAK. Review the specifications below when checking this part for your BOM.
The MBRD650CTTR is a surface-mount Schottky rectifier from Vishay, housed in a D-PAK (TO-252AA) package. It features a center tap configuration with two silicon elements. The device supports a maximum average forward current of 6 A per device and a repetitive peak reverse voltage of 50 V. Key electrical characteristics include a maximum forward voltage drop of 0.7 V at 3 A and a non-repetitive surge current rating of 490 A. The junction temperature range spans from -40 °C to 150 °C.
Verify the specific suffix 'TR' indicates tape and reel packaging when sourcing. Confirm lead-free compliance status as required by project specifications. Ensure the 50 V reverse voltage rating aligns with the circuit's peak inverse voltage requirements. Validate that the D-PAK thermal resistance values are sufficient for the intended heat dissipation conditions.
Select this component for designs requiring low forward voltage drop and high-frequency operation in a compact surface-mount form factor. The center tap design simplifies circuit topology for specific rectification needs. Consider the thermal resistance parameters to ensure adequate heat sinking or PCB copper area for reliable operation under continuous load conditions.
This part belongs to the MBRD650CT/MBRD660CT series of Schottky rectifiers designed for general-purpose switching applications. The series utilizes silicon technology to provide fast switching capabilities and low reverse leakage current. The D-PAK outline provides a robust mechanical solution for high-current density applications while maintaining a small board footprint.
Cross-reference with MBRD660CT for higher voltage ratings within the same package. Verify pinout compatibility with existing PCB layouts before substitution. Check thermal performance curves against the original design requirements to ensure equivalent heat dissipation capabilities.
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