MBRF200200

Diode Arrays Overview

The MBRF200200 is a dual Schottky barrier rectifier manufactured by GeneSiC Semiconductor. It features a common cathode configuration with two elements housed in a TO-244AB flange mount package. The device supports a maximum repetitive peak reverse voltage of 200 V and an average forward current of 100 A. Key electrical specifications include a maximum non-repetitive peak forward surge current of 800 A, a maximum DC reverse leakage current of 1000 µA, and a maximum forward voltage of 920 mV at 100 A. The junction temperature range spans from -55 °C to 150 °C.

Diode Arrays Feature Summary

• Utilizes Schottky technology for high-efficiency power rectification
• Dual element design configured as a common cathode pair
• Robust chassis mounting capability via TO-244AB package

Diode Arrays Applications

• High-frequency switching power supplies
• DC-DC converter circuits
• Free-wheeling rectification in motor drives

Diode Arrays Procurement Notes

Verify the specific ordering suffix against official GeneSiC documentation to ensure correct thermal and electrical characteristics. Confirm RoHS compliance status through current manufacturer declarations. Cross-reference the part number with authorized distributors to validate availability and authenticity. Request updated datasheets to check for any recent manufacturing changes or discontinuation notices prior to finalizing procurement plans.

Diode Arrays Selection Notes

Select this component for applications requiring high current handling and low forward voltage drop. Ensure the system's thermal management can support the TO-244AB package's dissipation requirements. Verify that the circuit's reverse voltage stress remains below the 200 V rating. Consider the common cathode topology for synchronous rectification or bridge-less PFC designs where dual diodes are necessary.

Diode Arrays Part Context

This device belongs to the MBRF series of high-power Schottky rectifiers designed for industrial and automotive electronics. The TO-244AB package provides superior thermal performance compared to standard axial or surface-mount options. It serves as a discrete solution for replacing integrated modules in high-current power conversion systems where individual diode control is preferred.

Diode Arrays Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source data. Consult the manufacturer's official replacement guide for direct equivalents.