MBRF4060CT

Diode Arrays Overview

The MBRF4060CT is a power Schottky rectifier manufactured by SMC Diode Solutions. It features a maximum repetitive reverse voltage of 60 V and an average forward rectified current of 40 A. The device utilizes a surface-mount TO-252AB (D2PAK) package with three terminals. Key electrical characteristics include a low forward voltage drop and high surge current capability, designed for high-efficiency power conversion applications.

Diode Arrays Feature Summary

• Schottky barrier technology for low forward voltage and high efficiency
• Surface-mount D2PAK package for automated assembly
• High junction temperature capability for reliable operation

Diode Arrays Applications

• Switching-mode power supplies
• Free-wheeling diodes in DC-DC converters
• General purpose rectification in low-voltage circuits

Diode Arrays Procurement Notes

Verify the specific suffix against the manufacturer's official datasheet to confirm pinout orientation and thermal pad configuration. Ensure the component meets RoHS compliance requirements for your target market. Cross-reference the ordering code with authorized distributors to confirm availability and authenticity before procurement.

Diode Arrays Selection Notes

Select this component for designs requiring a 40 A current rating at 60 V reverse voltage in a compact surface-mount form factor. Evaluate the thermal resistance of the D2PAK package against your PCB copper area to ensure adequate heat dissipation. Compare the forward voltage specifications with alternative packages to optimize system efficiency.

Diode Arrays Part Context

This part belongs to the MBR series of Schottky rectifiers from SMC Diode Solutions. The series offers various current ratings and voltage options in multiple package styles. The MBRF4060CT specifically addresses the need for high-current, low-voltage rectification in space-constrained surface-mount applications.

Diode Arrays Replacement Considerations

Check for direct replacements within the same series with identical pinouts and electrical ratings. Verify that any substitute component maintains the same package dimensions and thermal characteristics to fit existing footprints without redesign.