MBRP30060CT

Diode Arrays Overview

The MBRP30060CT is a dual common cathode Schottky barrier rectifier manufactured by onsemi. It features a 60 V repetitive peak reverse voltage rating and supports an average forward current of 150 A per diode leg. The device utilizes the PowerTap II package for base mounting, designed for high-efficiency power applications. Key electrical characteristics include a maximum forward voltage of 790 mV at 150 A and a reverse leakage current of 800 µA at 60 V. The component operates within a junction temperature range of -55°C to +175°C.

Diode Arrays Feature Summary

• Dual common cathode configuration for efficient bridge-less or full-wave rectification
• High surge capacity with robust thermal performance in PowerTap II package
• Guard-ring stress protection structure for enhanced reliability

Diode Arrays Applications

• Switch-mode power supply output rectification
• Power management systems requiring low forward voltage drop
• DC-DC converter circuits

Diode Arrays Procurement Notes

Verify component status as this part may be obsolete or subject to discontinuation notices. Confirm RoHS compliance and REACH SVHC declarations against current datasheets. Ensure the PowerTap II package dimensions match the target PCB footprint. Validate that the 150 A current rating aligns with thermal management capabilities in the final assembly.

Diode Arrays Selection Notes

Select this component for applications requiring high current handling in a compact base-mount form factor. The 60 V rating suits low-voltage DC bus applications. Consider the 790 mV forward voltage impact on system efficiency at full load. Compare thermal resistance specifications against available heatsinking options to ensure junction temperatures remain within safe operating limits during continuous operation.

Diode Arrays Part Context

This device belongs to the SWITCHMODE™ series of Schottky rectifiers from onsemi. It is designed specifically for high-efficiency power conversion applications where low forward voltage and high surge current capability are critical. The PowerTap II package provides superior thermal dissipation compared to standard through-hole packages, making it suitable for dense power electronics designs.

Diode Arrays Replacement Considerations

Publicly confirmed substitute part numbers were not identified in the provided source material. Verify compatibility with alternative high-current Schottky rectifiers in the PowerTap II package if this specific model is unavailable.