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MC100EL07DT is listed in the Gates And Inverters - Multi-Function, Configurable range at ChipApex. The manufacturer field lists onsemi. Its product description is IC GATE XOR/XNOR ECL 2INP 8TSSOP. Review the specifications below when checking this part for your BOM.
The MC100EL07DT is a single 2-input XOR/XNOR gate from the onsemi MC100EL series, designed for high-speed differential ECL applications. It operates within a supply voltage range of 4.2 V to 5.7 V and supports both PECL and NECL configurations. The device features a propagation delay of 260 ps, with low-level output current of 50 mA and high-level output current of -50 mA. It is housed in an 8-pin TSSOP package and functions across an industrial temperature range of -40°C to +85°C.
Verify the specific suffix 'DT' corresponds to the TSSOP-8 package and tape-and-reel or tube availability as required by your assembly process. Confirm RoHS compliance status and lead times directly with authorized distributors, as manufacturing allocations may vary. Ensure the ordering quantity matches the standard factory packaging specifications to avoid partial reel issues.
Select this component when a single configurable XOR/XNOR gate is needed in a compact surface-mount form factor. The TSSOP-8 package offers a smaller footprint compared to SOIC variants, suitable for dense PCB layouts. Consider the 260 ps delay and 50 mA drive strength against system power budgets and signal integrity requirements for high-speed differential paths.
This part belongs to the MC100EL family of 5V ECL logic devices, which are engineered for superior AC performance compared to earlier generations. The 100-series designation indicates enhanced speed and temperature compensation features relative to basic ECL gates. It serves as a fundamental building block for complex logic circuits requiring rapid state transitions and reliable differential operation.
MC100EL07DG (SOIC-8 variant) and MC100EL07DR2G (SOIC-8 reel variant) offer identical electrical characteristics but differ in physical package dimensions and shipping packaging format. Verify pin-to-pin compatibility and thermal management requirements before substituting between TSSOP and SOIC footprints.
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