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MC100EP11MNR4G is listed in the Clock Buffers, Drivers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC CLK BUFFER 1:2 3GHZ 8DFN. Review the specifications below when checking this part for your BOM.
The MC100EP11MNR4G is a differential 1:2 fanout buffer from the onsemi 100 Series, designed for high-speed ECL applications. It features temperature compensation and operates in PECL mode with VCC ranging from 3.0 V to 5.5 V (VEE = 0 V) or NECL mode with VEE from −3.0 V to −5.5 V (VCC = 0 V). The device provides two differential outputs (Q0, Q1) from a single differential input. Key electrical specifications include a maximum propagation delay of 270 ps at 25°C and a typical maximum clock frequency exceeding 3 GHz. It is housed in an 8-lead DFN package.
Verify component authenticity through authorized channels. Confirm RoHS compliance and Pb-free status as indicated by the ordering suffix. Check current availability status, as the datasheet notes discontinuation recommendations for certain variants within the series. Ensure thermal management requirements are met for the DFN-8 package.
Select this component when a differential fanout buffer with minimal propagation delay is required. The 100 Series offers temperature compensation compared to the standard 10 Series. Ensure supply voltage aligns with PECL or NECL requirements. Verify that the DFN-8 package fits the PCB layout constraints, noting the exposed pad must be connected to a thermal conduit.
This part belongs to the MC10/100EP11 family, which is pin and functionally equivalent to the LVEL11 device but with superior AC performance. The '100' prefix indicates the inclusion of internal temperature compensation. The 'MN' suffix specifies the DFN-8 package, while 'R4G' denotes tape and reel packaging with RoHS compliance.
The datasheet lists the MC10EP11DG, MC10EP11DR2G, MC100EP11DG, MC100EP11DR2G, MC100EP11DTG, and MC100EP11DTR2G as alternative packages within the same functional family. Direct substitution requires matching the package type (SOIC-8N B or TSSOP-8) and verifying power supply configurations.
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