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MC100EP31DTG is listed in the Flip Flops range at ChipApex. The manufacturer field lists onsemi. Its product description is IC FF D-TYPE SNGL 1BIT 8TSSOP. Review the specifications below when checking this part for your BOM.
The MC100EP31DTG is a single-element D-type flip-flop from the onsemi 100EP series, designed for high-speed ECL applications. It operates with a clock frequency of up to 3 GHz and supports positive-edge triggering. The device features set and reset functionality with differential outputs. It requires a negative supply voltage ranging from -3V to -5.5V and draws a static current of 45 mA. Housed in an 8-TSSOP package, it functions within a temperature range of -40°C to 85°C.
Verify the specific suffix DTG confirms the 8-TSSOP surface-mount package configuration. Confirm that the negative power supply rails align with the -3V to -5.5V operational requirements. Ensure thermal management strategies account for the 45 mA static current draw during continuous operation. Check component availability status as this part may be subject to lifecycle changes or obsolescence notices from the manufacturer.
Select this component when a single D-flip-flop with independent set and reset controls is required in a high-speed ECL environment. It is suitable for designs needing differential output signals to minimize electromagnetic interference. Consider the 8-TSSOP footprint for space-constrained printed circuit board layouts. Evaluate the 3 GHz speed capability against system timing constraints to ensure adequate performance margins for data setup and hold times.
This device belongs to the MC100EP family of ECL logic integrated circuits manufactured by onsemi. The family includes various logic gates, drivers, and flip-flops optimized for high-speed performance. The MC100EP31 specifically addresses the need for simple sequential logic with control inputs in differential signaling applications, complementing other members like the MC100EP29 and MC100EP35.
Direct substitutes include MC10EP31DTG and MC10EP31DG. Verify pinout compatibility and electrical parameter equivalence before substitution. Ensure the alternative package type matches the existing PCB footprint requirements.
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