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MC100EP52DT is listed in the Flip Flops range at ChipApex. The manufacturer field lists onsemi. Its product description is IC FLIP FLOP ECL DATA/CLK 8TSSOP. Review the specifications below when checking this part for your BOM.
The MC100EP52DT is a differential data and differential clock D flip-flop from the onsemi 100EP series. It operates in PECL mode with VCC from 3.0V to 5.5V (VEE=0V) or NECL mode with VEE from -3.0V to -5.5V (VCC=0V). The device features a typical propagation delay of 330ps and supports maximum frequencies greater than 4GHz. It includes input clamping circuitry for stable outputs under open input conditions, with Q output defaulting low when inputs are open or at VEE. The component is housed in an 8-TSSOP package.
Verify the specific suffix 'DT' against official onsemi documentation to confirm the exact package type and tape/reel specifications. Ensure compatibility with required operating voltage ranges for PECL or NECL applications. Confirm RoHS compliance status if environmental regulations apply to the target deployment. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit components.
Select this component for designs requiring high-frequency operation with differential signaling. Consider the 330ps propagation delay for tight timing budgets. Evaluate the thermal performance within the TSSOP package for the intended application environment. Compare against equivalent devices like EL52 if pin compatibility is a primary constraint.
The MC100EP52 belongs to the 100EP family of high-performance ECL logic devices. This series is designed for demanding applications where speed and signal integrity are critical. The device functions as a fundamental building block for sequential logic in high-speed circuits, providing reliable data storage and transfer capabilities.
The MC10EP52 is functionally equivalent but may differ in temperature compensation features. Verify electrical characteristics and pinout compatibility before substitution. Check if the alternative package variant meets the physical space constraints of the design.
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