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MC100LVEL12DTG is listed in the Gates And Inverters - Multi-Function, Configurable range at ChipApex. The manufacturer field lists onsemi. Its product description is IC BUFFER DVR ECL NON-INV 8TSSOP. Review the specifications below when checking this part for your BOM.
The MC100LVEL12DTG is a low impedance drive buffer from the 100LVEL series, designed for high-speed applications requiring ultimate AC performance in a low voltage environment. It features two pairs of OR/NOR outputs and operates from a 3.3 V power supply with PECL or NECL modes. The device provides a propagation delay of 445 ps typical at 25°C, with a maximum toggle frequency of TBD GHz. Power supply current ranges from 17 mA to 25 mA depending on temperature. It is housed in an 8-pin TSSOP package.
Verify the specific ordering suffix DTG confirms the TSSOP-8 package and lead-free status as documented in the manufacturer's ordering information table. Ensure compatibility with the required thermal management specifications for the chosen PCB layout, particularly regarding junction-to-ambient resistance values under different airflow conditions.
Select this component when dual differential outputs and low impedance driving are necessary for signal integrity in high-speed designs. Consider the 445 ps propagation delay and TBD GHz toggle frequency against system timing requirements. Verify that the 3.3 V supply voltage aligns with the PECL or NECL mode configuration needed for the target application interface.
This device belongs to the MC100LVEL family of low voltage ECL logic components. It is functionally equivalent to the EL12 device but optimized for 3.3 V operation. The family includes various packages such as SOIC, DFN, and TSSOP, offering flexibility for different board space and thermal constraints while maintaining consistent logical functionality and speed characteristics.
The MC100LVEL12D and MC100LVEL12DG are direct functional equivalents differing primarily in packaging (SOIC vs. TSSOP) and lead-free status. Verify pinout compatibility and thermal dissipation requirements when substituting between package types within the same logical family.
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