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MC100LVEP11DTG is listed in the Clock Buffers, Drivers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC CLK BUFFER 1:2 3GHZ 8TSSOP. Review the specifications below when checking this part for your BOM.
The MC100LVEP11DTG is a differential 1:2 fanout buffer from the ECL family, manufactured by onsemi. It features temperature compensation and supports PECL mode with VCC ranging from 2.375 V to 3.8 V (VEE = 0 V) or NECL mode with VEE from −2.375 V to −3.8 V (VCC = 0 V). The device operates up to a maximum frequency of 3.0 GHz with a typical propagation delay of 240 ps. It is housed in an 8-lead TSSOP package (DT suffix) and includes LVDS input compatibility.
Verify that the ordering suffix DTG corresponds to the TSSOP-8 package with Pb-Free compliance. Confirm the specific revision level matches the design requirements, as datasheet revisions may update electrical characteristics or mechanical dimensions. Ensure thermal management considerations align with the junction-to-ambient resistance values provided for the TSSOP-8 package under standard board conditions.
Select the MC100LVEP11 variant specifically when temperature compensation is required, distinguishing it from the MC10LVEP11 which lacks this feature. Choose the DTG suffix for surface-mount assembly using the TSSOP-8 footprint. Verify that the application voltage falls within the specified PECL or NECL ranges to ensure proper logic levels and output swing characteristics.
This component belongs to the MC10/100LVEP11 series, which are pin and functionally equivalent to the legacy EP11 device. The 100 Series designation indicates the inclusion of temperature compensation circuitry, providing more stable performance across the industrial temperature range compared to the standard 10 Series devices.
The MC10LVEP11DTG serves as a direct functional replacement but lacks the temperature compensation found in the MC100LVEP11. Other variants such as MC100LVEP11DG (SOIC-8) or MC100LVEP11MNR4G (DFN-8) offer alternative packages but require PCB layout adjustments.
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