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MC100LVEP11DTR2 is listed in the Clock Buffers, Drivers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC CLOCK BUFFER 1:2 3GHZ 8-TSSOP. Review the specifications below when checking this part for your BOM.
The MC100LVEP11DTR2G is a differential 1:2 fanout buffer from the 100 Series, featuring temperature compensation. It operates in PECL mode with VCC ranging from 2.375 V to 3.8 V (VEE = 0 V) or NECL mode with VEE from −2.375 V to −3.8 V (VCC = 0 V). The device supports maximum frequencies exceeding 3.0 GHz, with typical propagation delays of 240 ps and output-to-output skew under 20 ps. It accepts LVDS-compatible inputs and provides open input default states where outputs go LOW. Packaged in TSSOP-8, it meets RoHS standards.
Verify the complete ordering code includes the 'G' suffix for Pb-Free compliance, as indicated in the datasheet's ordering information table. Confirm the package suffix corresponds to TSSOP-8 (DT) and the reel quantity matches the TR2 designation. Ensure the source document explicitly lists MC100LVEP11DTR2G to validate the specific variant against generic family listings.
Select this component when temperature compensation is required for stable performance across the −40°C to +85°C range. Choose the TSSOP-8 package for space-constrained surface-mount applications. Verify that the system power supply aligns with either the PECL or NECL operating ranges, noting that single-ended CLK input operation is limited to specific voltage thresholds in each mode.
This device belongs to the MC10/100LVEP11 family, which are pin and functionally equivalent to the EP11 series. The 100 Series specifically incorporates internal temperature compensation, distinguishing it from the standard 10 Series. It serves as a direct replacement for older EP11 devices in designs requiring lower voltage compatibility while maintaining high-frequency performance.
Public confirmed substitute part numbers include MC10LVEP11DR2G and MC100LVEP11DG. These variants share identical electrical characteristics and pinouts but differ in packaging (SOIC-8N B vs. TSSOP-8) or shipping format (Tape & Reel vs. Tube). Verify thermal resistance values if transitioning between SOIC and TSSOP packages.
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