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MC10E175FN is listed in the Latches range at ChipApex. The manufacturer field lists onsemi. Its product description is IC LATCH 9BIT PARITY ECL 28-PLCC. Review the specifications below when checking this part for your BOM.
The MC10E175FN is a D-type transparent latch integrated circuit manufactured by onsemi. It operates within the 10E series and features a single channel with a 9:9 circuit configuration. The device utilizes ECL technology and provides standard output types. It is housed in a 28-PLCC package, specifically a 28-LCC (J-Lead) form factor measuring 11.51x11.51 mm. Electrical specifications include a supply voltage range of 4.2V to 5.5V and a propagation delay of 800ps. The component supports surface mount installation and functions within an operating temperature range of 0°C to 85°C.
Verify component authenticity through authorized distributors or certified suppliers. Confirm RoHS compliance status as indicated in official documentation. Check moisture sensitivity level ratings before soldering. Ensure proper handling procedures are followed due to ECL technology requirements. Validate part number suffixes against manufacturer datasheets to confirm exact electrical characteristics and packaging details.
Select this component when designing high-speed logic circuits requiring transparent latch functionality. Consider the 28-PLCC package constraints for PCB layout. Evaluate power supply stability within the specified voltage range. Assess thermal management needs for the 0°C to 85°C operating range. Compare performance metrics against alternative ECL devices if system timing budgets require tighter margins.
This device belongs to the onsemi 10E series of ECL logic components. It serves as a specialized latch solution for high-frequency applications. The product line focuses on delivering precise timing control in complex digital systems. Engineers utilize this series for its consistent performance in demanding electronic environments.
Consult official substitution guides for equivalent parts. Verify pin compatibility and electrical parameters before swapping components. Ensure replacement devices meet the same package and thermal requirements.
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