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MC10XS6225BEK
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Product Detailed Parameters
- Description：IC PWR SWITCH HIGH SIDE 32SOIC
- Series：-
- Mfr：NXP USA Inc.
- Package：Tube
- Switch Type：General Purpose
- Number of Outputs：2
- Ratio - Input:Output：-
- Output Configuration：High Side
- Output Type：-
- Interface：SPI
- Voltage - Load：7V ~ 18V
- Voltage - Supply (Vcc/Vdd)：4.5V ~ 5.5V
- Current - Output (Max)：4.5A, 9A
- Rds On (Typ)：10mOhm, 25mOhm
- Input Type：-
- Features：Status Flag
- Fault Protection：Open Load Detect, Over Temperature
- Operating Temperature：-40°C ~ 125°C (TA)
- Mounting Type：Surface Mount
- Supplier Device Package：32-SOIC-EP
- Package / Case：32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Grade：-
- Qualification：-
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Overview
The MC10XS6225BEK is a high-side power switch IC from the MC10XS6225 series, manufactured by NXP Semiconductors. It features dual channels with on-resistances of 10 mOhms and 25 mOhms respectively. The device is housed in an HSOP32 package and supports a 12V system voltage. It includes integrated protection mechanisms such as overcurrent protection and thermal shutdown to ensure reliable operation in power distribution applications.
Feature Summary
- Dual-channel high-side switching capability with distinct low on-resistance values for optimized power distribution
- Integrated overcurrent protection and thermal shutdown for enhanced circuit safety and reliability
- Designed for robust performance in 12V automotive and industrial power management systems
Applications
- Automotive body electronics power distribution
- Industrial control system load switching
- General-purpose high-side power switching in 12V networks
Procurement Notes
Verify component authenticity through authorized NXP distributors or certified supply chain partners. Confirm that the part number matches the specific datasheet requirements for your application. Check for moisture sensitivity handling instructions if storage conditions have been exceeded. Ensure compatibility with existing PCB footprints and thermal management designs before integration.
Selection Notes
Select this component when dual-channel high-side switching with low on-resistance is required. Compare the 10 mOhm and 25 mOhm channel options against load current requirements. Evaluate the HSOP32 package size against available board space. Consider the integrated protection features for simplified design compared to discrete solutions.
Part Context
This part belongs to the MC10XS6225 family of high-side switches. It shares functional similarities with other members like the MC10XS6325BEK but differs in specific pinout configurations and internal protection thresholds. The series is designed for automotive-grade reliability and offers a compact solution for multi-channel power distribution needs.
Replacement Considerations
Direct substitutes within the same family include the MC10XS6325BEK. Verify pin-to-pin compatibility and electrical parameter alignment before substitution. Consult official NXP documentation for detailed cross-reference information and any necessary design adjustments.
