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Product Detailed Parameters
- Description:IC PWR SWITCH HIGH SIDE 32HSOP
- Series:-
- Mfr:NXP USA Inc.
- Package:Tube
- Switch Type:General Purpose
- Number of Outputs:3
- Ratio - Input:Output:-
- Output Configuration:High Side
- Output Type:-
- Interface:SPI
- Voltage - Load:7V ~ 18V
- Voltage - Supply (Vcc/Vdd):4.5V ~ 5.5V
- Current - Output (Max):3.8A, 9A
- Rds On (Typ):10mOhm, 25mOhm
- Input Type:-
- Features:Status Flag
- Fault Protection:Open Load Detect, Over Temperature
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Supplier Device Package:32-HSOP
- Package / Case:32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Grade:-
- Qualification:-
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Overview
The MC10XS6325EK is a high-side power switch integrated circuit manufactured by NXP. It features an extremely low on-state resistance of 10 mOhm, enabling efficient power distribution with minimal voltage drop and heat generation. The device includes comprehensive protection mechanisms such as over-current protection, thermal shutdown, and reverse polarity protection to ensure system reliability. Designed for robust automotive and industrial applications, it offers precise load control and diagnostic feedback through its interface pins.
Feature Summary
- Ultra-low on-resistance for high efficiency
- Integrated over-current and thermal protection
- Reverse polarity protection capability
- Diagnostic status reporting
Applications
- Automotive lighting systems
- Industrial motor control loads
- High-power relay driver circuits
- Battery management system switches
Procurement Notes
Verify the exact suffix 'EK' against official NXP documentation to confirm package type and tape/reel specifications. Ensure compatibility with your PCB footprint and thermal requirements. Check RoHS compliance status in the latest datasheet. Confirm moisture sensitivity level (MSL) handling procedures during assembly. Validate that the 10 mOhm rating aligns with your specific current load demands.
Selection Notes
Select this component when low conduction loss is critical for thermal management. Compare against the 25 mOhm variant if cost or availability is a constraint and slightly higher dissipation is acceptable. Consider the HSOP32 package size for board space limitations. Evaluate the need for diagnostic features versus simpler switch options. Ensure the operating temperature range meets your application environment.
Part Context
This part belongs to NXP's MC10XS series of high-side switches, designed for demanding power distribution tasks. It complements other variants like the MC10XS6225 which may offer different resistance values or pin configurations. The series targets automotive and industrial markets requiring reliable, protected switching solutions. It fits within NXP's broader portfolio of power management and signal conditioning devices.
Replacement Considerations
Check for direct cross-reference part numbers from NXP or other manufacturers offering similar 10 mOhm high-side switches. Verify pin-to-pin compatibility if substituting. Review electrical parameters like max current and breakdown voltage to ensure equivalence. Consult NXP's official replacement guide for validated alternatives.
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