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MC13892CJVKR2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC PWR MGMT I.MX35/51 139BGA. Review the specifications below when checking this part for your BOM.
The MC13892CJVKR2 is a specialized Power Management Integrated Circuit (PMIC) designed for i.MX51, i.MX37, i.MX3, and i.MX27 application processors. It integrates four buck converters and twelve low-dropout regulators (LDOs). The device operates within a temperature range of -40°C to +85°C and utilizes a 139-pin BGA package with dimensions of 7x7 mm. It supports surface-mount technology and includes battery management capabilities.
Verify the specific suffix 'KR2' against the official NXP datasheet to confirm tape-and-reel packaging specifications and moisture sensitivity levels. Ensure compatibility with the target PCB footprint for the 139-PBGA package. Confirm that the operating temperature range meets the environmental requirements of the final assembly. Check for any RoHS compliance documentation required by the destination market regulations.
Select this component when designing systems based on i.MX51 or i.MX37 processors requiring integrated power management. It is suitable for applications needing multiple regulated rails from a single IC. Consider the thermal performance of the BGA package in the system layout. Verify that the input voltage ranges align with the system's battery or supply architecture.
This PMIC belongs to the MC13892 family, which serves as a companion power solution for NXP's i.MX application processor lines. It consolidates power management functions to reduce board space and component count in mobile and multimedia devices. The device replaces discrete regulator solutions, simplifying the design process for handheld electronics.
Check for updated revisions within the MC13892 family. Verify pin-to-pin compatibility if substituting with other variants like MC13892AJVKR2, noting differences in output configurations and package types.
It is designed for i.MX51, i.MX37, i.MX3, and i.MX27 application processors.
It uses a 139-pin Plastic Ball Grid Array (PBGA) package with a 7x7 mm footprint.
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