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MC13892DJVL is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC PWR MGMT I.MX35/51 186BGA. Review the specifications below when checking this part for your BOM.
Power Management - Specialized specifications for MC13892DJVL
- Description：IC PWR MGMT I.MX35/51 186BGA
- Series：-
- Mfr：NXP USA Inc.
- Package：Tray
- Applications：Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
- Current - Supply：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：186-LFBGA
- Supplier Device Package：186-PBGA (12x12)
- Grade：-
- Qualification：-
Power Management - Specialized datasheet and documents for MC13892DJVL
Power Management - Specialized Overview
The MC13892DJVL is a Power Management Integrated Circuit (PMIC) manufactured by NXP Semiconductors. It operates within a temperature range of -40°C to +85°C and is packaged in an 186-pin PBGA (12x12 mm) format. This component is specifically designed for use with i.MX51, i.MX37, i.MX3, and i.MX27 application processors.
Power Management - Specialized Feature Summary
- Integrated power management solution tailored for specific Freescale/NXP application processor families
- Supports battery management and display LED driver functions
- Optimized for portable personal media players and navigation devices
Power Management - Specialized Applications
- Personal media players
- Navigation devices
- Systems utilizing i.MX51, i.MX37, i.MX3, or i.MX27 processors
Power Management - Specialized Procurement Notes
Verify the package type is 186-PBGA (12x12) and confirm the operating temperature range covers -40°C to +85°C. Ensure compatibility with the target i.MX processor family before procurement. Check datasheet revisions for any pinout or electrical specification updates.
Power Management - Specialized Selection Notes
Select this PMIC only when designing systems based on i.MX51, i.MX37, i.MX3, or i.MX27 application processors. It provides integrated power sequencing and management features required by these specific SoCs. Verify that the 186-pin BGA footprint fits the PCB layout constraints.
Power Management - Specialized Part Context
This component belongs to the MC13892 series of Power Management ICs. It serves as a companion chip for Freescale (now NXP) i.MX application processors, consolidating multiple power rails into a single package to reduce board space and complexity in mobile handheld devices.
Power Management - Specialized Replacement Considerations
No direct public substitute part numbers are confirmed in the provided documentation. Design changes may be required if substituting with other PMICs due to specific integration with i.MX processor families.
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