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MC14174BCPG is listed in the Flip Flops range at ChipApex. The manufacturer field lists onsemi. Its product description is IC FF D-TYPE SNGL 6BIT 16DIP. Review the specifications below when checking this part for your BOM.
The MC14174BCPG is a Hex D-Type Flip-Flop from the MC14 logic series, manufactured by onsemi. It integrates six independent D-type flip-flops in a single SOIC-16 package. The device operates with a supply voltage range of 3 V to 18 V and supports surface-mount installation. Key electrical specifications include a propagation delay of 400 ns, a high-level output current of -4.2 mA, and a low-level output current of 4.2 mA. It functions with non-inverting outputs and single-ended inputs, operating within a temperature range of -55 °C to +125 °C.
Verify the specific suffix 'BCPG' against the manufacturer's official datasheet to confirm pinout compatibility and RoHS compliance status. Ensure the procurement channel provides traceable documentation matching the MC14 series specifications. Confirm that the SOIC-16 package dimensions align with the target PCB footprint requirements before finalizing orders.
Select this component when a hex configuration of D-type flip-flops is required within the MC14 CMOS family. It is suitable for designs needing wide voltage tolerance and industrial-grade thermal stability. Consider the 400 ns propagation delay for timing constraints. Verify that the single-ended input/output architecture matches the system interface requirements compared to differential or tri-state alternatives.
This part belongs to the MC14174B series of Hex Type D Flip-Flops produced by onsemi. It is functionally equivalent to other variants such as MC14174BCP and MC14174BDR2G, differing primarily in packaging type (PDIP vs. SOIC) and reel specifications. The MC14 series represents standard CMOS logic technology designed for general-purpose digital applications.
MC14174BDR2G offers identical logical functionality in an SOIC-16 surface-mount package. MC14174BCP provides the same hex flip-flop configuration in a PDIP through-hole package. Verify pin compatibility and package dimensions when substituting between these variants.
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