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MC16XSD200FKR2
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Product Detailed Parameters
- Description：IC PWR SWITCH N-CHAN 1:1 23PQFN
- Series：-
- Mfr：NXP USA Inc.
- Package：Tape & Reel (TR)
- Switch Type：General Purpose
- Number of Outputs：2
- Ratio - Input:Output：1:01
- Output Configuration：High Side
- Output Type：N-Channel
- Interface：SPI
- Voltage - Load：8V ~ 36V
- Voltage - Supply (Vcc/Vdd)：3V ~ 5.5V
- Current - Output (Max)：3A
- Rds On (Typ)：16mOhm (Max)
- Input Type：-
- Features：Internal PWM, Slew Rate Controlled, Watchdog Timer
- Fault Protection：Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Surface Mount
- Supplier Device Package：23-PQFN (12x12)
- Package / Case：23-PowerQFN
- Grade：-
- Qualification：-
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Overview
The MC16XSD200FKR2 is a high-side power switch manufactured by NXP USA Inc. It features dual independent channels with an N-channel configuration and a maximum continuous current rating of 3A per channel. The device utilizes a 23-PQFN package measuring 12x12 mm. It operates with a low on-resistance of 16mOhms, designed for efficient power distribution and load management in electronic systems.
Feature Summary
- Dual independent high-side switching capability
- Low on-resistance for efficient power delivery
- Compact surface-mount packaging
Applications
- Power distribution networks
- Load management circuits
- General purpose switching applications
Procurement Notes
Verify the exact package dimensions and thermal characteristics against the official datasheet before integration. Confirm that the 3A current rating aligns with your system's peak load requirements. Ensure compatibility with the control logic levels required to drive the N-channel switches effectively within your specific circuit design constraints.
Selection Notes
Select this component when dual isolated high-side switching is required in a compact form factor. The 16mOhm resistance makes it suitable for applications prioritizing minimal voltage drop and heat generation. Consider the 23-PQFN footprint for PCB layout constraints and ensure adequate thermal relief is provided during assembly.
Part Context
This part belongs to NXP's power management portfolio, specifically categorized under power distribution switches. It serves as a solid-state alternative to mechanical relays or fuses in modern electronics, offering faster switching speeds and longer operational life. The manufacturer provides technical documentation detailing electrical characteristics and application guidelines.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided source material. Consult NXP USA Inc. directly for qualified alternatives or cross-reference options based on specific pinout and electrical parameter matching requirements.
