MC17XS6500BEKR2

Overview

The MC17XS6500BEKR2 is a high-side switch IC designed for automotive lighting applications, featuring six independent output channels. It utilizes SMARTMOS technology to deliver a typical on-resistance of 17 mΩ per channel with a maximum continuous output current of 5.5 A. The device operates within a load voltage range of 7 V to 18 V and supports an extended mode up to 28 V. Control is managed via a 5.0 MHz SPI interface. Key protection features include dynamic overcurrent thresholds, open-load detection, thermal shutdown, and a fail-safe operation mode that maintains functionality during communication loss.

Feature Summary

• Dynamic overcurrent threshold profile prevents shutdown during inrush currents while tracking load current
• Fail operation mode ensures continued operational control and protection when external microcontroller communication is lost
• Output edge shaping capabilities improve electromagnetic performance
• Programmable sensing ratio allows precise current monitoring for each individual channel

Applications

• Automotive incandescent lamp control
• Light-emitting diode (LED) driver circuits
• Electronic Control Unit (ECU) power distribution
• High-side switching for automotive lighting loads

Procurement Notes

Verify the specific suffix 'B' against official NXP documentation to confirm if it denotes a distinct revision or package variant compared to standard listings. Confirm RoHS compliance status and moisture sensitivity level prior to integration. Ensure the 32-HSOP exposed pad footprint matches the target PCB design. Validate that the 5.0 MHz SPI timing requirements align with the host microcontroller specifications.

Selection Notes

Select this component for designs requiring robust fault handling and precise current regulation in automotive lighting systems. The integrated fail-safe mode reduces software complexity by maintaining basic protection without MCU intervention. The low on-resistance minimizes power dissipation, while the wide operating voltage range accommodates various automotive bus conditions. Consider the exposed pad thermal management requirements inherent to the HSOP-32 package.

Part Context

This part belongs to the MC17XS6 series of smart high-side switches from NXP Semiconductors. The family is characterized by daisy-chainable SPI connectivity and compatible MCU software across variants. These devices are engineered for enhanced precision in controlling both incandescent lamps and LEDs, offering a standardized PCB footprint to facilitate ECU design scalability within automotive applications.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided data.