— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:HIGH-SIDE SWITCH, 12V, PENTA 17M
- Series:-
- Mfr:NXP USA Inc.
- Package:Tube
- Switch Type:General Purpose
- Number of Outputs:6
- Ratio - Input:Output:2:03
- Output Configuration:High Side
- Output Type:N-Channel
- Interface:SPI
- Voltage - Load:7V ~ 18V
- Voltage - Supply (Vcc/Vdd):4.5V ~ 5.5V
- Current - Output (Max):5.5A
- Rds On (Typ):17mOhm
- Input Type:-
- Features:Internal PWM
- Fault Protection:Current Limiting (Fixed), Open Load Detect, Over Temperature
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Supplier Device Package:32-HSOP
- Package / Case:32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Grade:Automotive
- Qualification:AEC-Q100
Download product information
Overview
The MC17XS6500EEK is a high-side power switch IC from NXP Semiconductors, designed for automotive lighting applications. It features five independent channels with a typical on-resistance of 17 milliohms. The device operates within a load voltage range of 7V to 18V and supports a supply voltage of 4.5V to 5.5V. It utilizes a 32-pin HSOP package with exposed pad for surface mount installation. Key electrical characteristics include an operating temperature range of -40°C to 125°C and a maximum sleep current of less than 5.0 µA.
Feature Summary
- Integrates five high-side switches with dynamic overcurrent threshold profiling to manage inrush currents while maintaining precise load current tracking.
- Features 16-bit SPI control interface supporting up to 5.0 MHz for configuring PWM duty cycles, fault reporting, and channel management.
- Includes comprehensive protection mechanisms such as thermal shutdown, open load detection, and reverse polarity protection.
- Provides programmable current sensing ratios and battery voltage feedback for enhanced diagnostic capabilities.
Applications
- Automotive incandescent lamp control
- LED lighting driver circuits
- Electronic Control Unit (ECU) peripheral switching
Procurement Notes
Verify the specific suffix EK indicates lead-free packaging status as per manufacturer documentation. Confirm the package type matches the 32-HSOP specification with exposed pad requirements for thermal dissipation. Ensure compatibility with existing PCB footprints when replacing variants within the MC17XS6500 family. Check for any obsolescence notices or alternative package recommendations from NXP USA Inc. prior to finalizing procurement plans.
Selection Notes
Select this component for applications requiring multiple high-side outputs with integrated diagnostics. Consider the 17 milliohm on-resistance for efficiency calculations in low-voltage automotive systems. Evaluate the SPI interface speed and pin count against microcontroller availability. Assess the thermal performance requirements given the 125°C junction temperature limit and package thermal characteristics.
Part Context
This part belongs to the MC17XS6500 family of smart high-side switches, which are optimized for automotive lighting and general-purpose load driving. The family shares compatible PCB footprints and software drivers across different channel counts and resistance values. It represents a generation of devices designed to facilitate ECU design through standardized interfaces and robust fault protection features.
Replacement Considerations
Compatible substitutes within the same family include MC17XS6500BEK and MC17XS6500CEK, which share identical pinouts and functional specifications. Verify that the replacement variant maintains the required 17 milliohm on-resistance and 5-channel configuration. Ensure the suffix indicates equivalent packaging and environmental compliance standards.
ChipApex | Global Electronic Components Supplier








