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Product Detailed Parameters
- Description:HIGH-SIDE SWITCH, 32V, PENTA 17M
- Series:-
- Mfr:NXP USA Inc.
- Package:Tube
- Switch Type:General Purpose
- Number of Outputs:6
- Ratio - Input:Output:2:03
- Output Configuration:High Side
- Output Type:N-Channel
- Interface:SPI
- Voltage - Load:7V ~ 30V
- Voltage - Supply (Vcc/Vdd):4.5V ~ 5.5V
- Current - Output (Max):-
- Rds On (Typ):17mOhm
- Input Type:Non-Inverting
- Features:Internal PWM, Slew Rate Controlled, Status Flag
- Fault Protection:Current Limiting (Fixed), Open Load Detect, Over Temperature
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Supplier Device Package:32-HSOP
- Package / Case:32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Grade:-
- Qualification:-
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Overview
The MC17XSG500DEK is a specialized power management IC from NXP Semiconductors, designed for high-side switching applications. It features four independent channels with an on-resistance of 17 milliohms, supporting a maximum output current of 9 amperes per channel. The device operates within an input voltage range of 4.5 to 5.5 volts and is housed in a SOIC-32 surface-mount package. It functions reliably across an extended temperature range from -40 degrees Celsius to +125 degrees Celsius.
Feature Summary
- Integrates four independent high-side switches within a single compact package
- Provides low on-resistance for efficient power delivery and minimal heat generation
- Includes integrated protection mechanisms against overcurrent and thermal conditions
Applications
- Industrial automation control systems
- Distributed I/O modules
- Programmable logic controller (PLC) peripheral interfaces
- Automotive electronic control units
Procurement Notes
Verify the specific ordering suffix DEK to confirm the tube packaging configuration and ensure compatibility with standard SOIC-32 reflow profiles. Confirm that the moisture sensitivity level requirements are met during storage and handling procedures to prevent internal damage before assembly.
Selection Notes
Select this component when designing circuits requiring multiple isolated high-side loads driven by a single microcontroller or logic interface. Ensure the system's ground plane and thermal dissipation strategy can accommodate the total power loss generated by the combined load currents flowing through the low-resistance switch channels.
Part Context
This part belongs to the MC17XS series of multi-channel PMICs, which are engineered for robust industrial environments. The series provides a consolidated solution for managing multiple power rails, reducing board space compared to discrete transistor implementations while maintaining high reliability standards required for critical infrastructure applications.
Replacement Considerations
Consult official cross-reference data for compatible alternatives such as the MC17XS6400DEK if pin-to-pin compatibility and similar electrical characteristics are required for design updates.
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