MC17XSG500EKR2

Overview

The MC17XSG500EKR2 is a power distribution switch IC manufactured by NXP USA Inc., designed for high-current load driving applications. It features six independent N-channel outputs configured as high-side switches, capable of handling load voltages from 7V to 18V. The device operates with a supply voltage range of 4.5V to 5.5V and utilizes an SPI interface for control. Key electrical specifications include a maximum on-resistance of 17 mOhms and compliance with AEC-Q100 automotive standards. It supports surface mount installation in a 32-HSOP package with exposed pad, operating within a temperature range of -40°C to +125°C.

Feature Summary

• Integrates internal PWM functionality for efficient load control
• Provides comprehensive fault protection including fixed current limiting, open load detection, and over-temperature shutdown
• Features low on-resistance for minimal power loss in high-current applications
• Supports digital control via SPI interface for precise configuration

Applications

• Automotive power distribution systems
• High-side load switching in industrial equipment
• Battery management system load drivers
• General purpose power distribution networks

Procurement Notes

Verify component authenticity through authorized distributors due to end-of-life status. Confirm package variant matches the 32-HSOP specification with exposed thermal pad. Check RoHS compliance documentation for environmental regulations. Ensure storage conditions account for moisture sensitivity level 3 requirements prior to reflow soldering.

Selection Notes

Select this component for applications requiring multiple high-side switches with integrated diagnostic capabilities. The SPI interface allows for flexible configuration compared to parallel control alternatives. Consider the 17 mOhm on-resistance for thermal management in dense PCB layouts. Verify that the 18V maximum load voltage aligns with system bus requirements.

Part Context

This part belongs to the MC17XS6500 series of power distribution switches from NXP Semiconductors. The series is characterized by its robust fault protection mechanisms and automotive-grade reliability. The specific model integrates six channels into a single compact package, reducing board space compared to discrete solutions. It serves as a centralized power distribution unit in complex electronic architectures.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. The component status is listed as discontinued or obsolete. Designers should evaluate alternative NXP power switch ICs with similar channel counts and interface protocols for migration strategies.