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Product Detailed Parameters
- Description:IC PWR SWITCH HIGH SIDE 32SOIC
- Series:-
- Mfr:NXP USA Inc.
- Package:Tube
- Switch Type:General Purpose
- Number of Outputs:3
- Ratio - Input:Output:-
- Output Configuration:High Side
- Output Type:-
- Interface:SPI
- Voltage - Load:7V ~ 18V
- Voltage - Supply (Vcc/Vdd):4.5V ~ 5.5V
- Current - Output (Max):4.5A
- Rds On (Typ):25mOhm
- Input Type:-
- Features:Status Flag
- Fault Protection:Open Load Detect, Over Temperature
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Supplier Device Package:32-SOIC-EP
- Package / Case:32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Grade:-
- Qualification:-
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Overview
The MC25XS6300BEK is a triple high-side power switch IC from NXP Semiconductors, designed for robust load control in demanding environments. It features three independent channels with a typical on-resistance (RDS(ON)) of less than 25 milliohms, enabling efficient power delivery to various load types including bulb lamps and motors. The device operates within a load voltage range of 7V to 18V and supports a maximum output current of 4.5A per channel. Powered by a supply voltage between 4.5V and 5.5V, it integrates comprehensive protection mechanisms such as over-temperature shutdown, over-current protection, and reverse polarity protection. Housed in a 32-SOIC-EP package, this component ensures reliable performance in automotive and industrial applications.
Feature Summary
- Triple-channel high-side switching architecture with low on-resistance for efficient power management
- Integrated diagnostic and protection features including over-temperature, over-current, and reverse polarity safeguards
- Designed for compatibility with standard logic interfaces for straightforward control integration
Applications
- Truck and bus electrical systems
- Industrial machinery load control
- Automotive lighting and accessory circuits
Procurement Notes
Verify the specific suffix and revision level against official NXP documentation to ensure compatibility with your design requirements. Confirm that the 32-SOIC-EP package dimensions and thermal pad specifications match your PCB layout constraints. Check for any end-of-life notices or alternative recommendations if long-term supply stability is critical for your production timeline.
Selection Notes
Select this component when multiple high-current loads require individual control with integrated protection in a compact form factor. Ensure the system's supply voltage remains within the 4.5V to 5.5V range and that the load voltage does not exceed 18V. Consider the thermal dissipation capabilities of the 32-SOIC-EP package relative to the expected continuous current load and ambient operating conditions.
Part Context
This part belongs to NXP's MC25XS series of high-side switches, engineered for automotive and industrial markets. The series emphasizes reliability and integration, combining power switching with advanced diagnostics in a single IC. The MC25XS6300BEK specifically targets applications requiring three independently controllable outputs with high current capacity and robust fault protection.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Consult NXP technical support or authorized distributors for validated alternatives if this component is obsolete or unavailable.
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