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MC33596FJER2 is listed in the RF Receivers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is UHF RECEIVER. Review the specifications below when checking this part for your BOM.
The MC33596FJER2 is a highly integrated RF receiver designed for low-voltage applications, manufactured by NXP USA Inc. It supports FSK and OOK modulation protocols across multiple frequency bands including 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, and 915MHz. The device features a programmable PLL for multi-channel operation and offers a sensitivity of -104dBm with a maximum data rate of 22.4kBaud. It operates on supply voltages of 2.7V to 3.6V or 4.5V to 5.5V, drawing 10.3mA during reception. Housed in a 32-LQFP package, it functions within a temperature range of -40°C to 85°C.
Verify component authenticity through authorized distributors as the part status is obsolete. Confirm package integrity and pin alignment against the 32-LQFP specification before integration. Check RoHS compliance status and environmental certifications required for your specific manufacturing region. Ensure supply chain stability due to potential discontinuation risks associated with legacy components.
Select this component when multi-band UHF reception is required with minimal external circuitry. Compare power consumption metrics against alternative receivers if battery life is critical. Evaluate the programmable PLL capabilities against fixed-frequency requirements to ensure optimal channel selection flexibility. Consider the operating voltage range compatibility with existing system power rails.
This receiver belongs to the MC335 series from NXP, focusing on integrated wireless communication solutions. It complements other NXP RF products by offering configurable frequency options within a single package. The design targets cost-sensitive applications requiring robust performance without complex external tuning components.
Public confirmed substitute part numbers include MC33596FCE and MC33596FJE. Verify pinout compatibility and electrical specifications before substitution. Note that packaging differences may require PCB layout adjustments.
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