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The MC33771BSP2AE is a 14-channel lithium-ion battery cell controller IC designed for automotive and industrial applications. It operates within a supply voltage range of 9.6 V to 61.6 V, supporting up to 75 V transients. The device features advanced voltage and temperature measurement with a maximum total stack voltage error of 0.8 mV. It integrates an onboard passive balancing MOSFET capable of 300 mA current. Communication is supported via standard SPI or transformer-isolated daisy chain at speeds up to 4 Mbps. The component complies with AEC-Q100 standards and supports ISO 26262 functional safety up to ASIL D.
Verify the specific suffix 'S' in the part number MC33771BSP2AE against official NXP documentation to confirm package type and tape/reel specifications. Ensure compatibility with the intended PCB footprint, as LQFP-EP-64 variants exist. Confirm that the selected variant meets the required AEC-Q100 qualification grade for the target automotive or industrial environment before finalizing procurement.
Select this controller when designing systems requiring up to 14 series-connected lithium-ion cells. It is suitable for applications demanding high precision voltage measurement and integrated passive balancing. Consider the MC33664 transceiver if transformer-isolated daisy chain communication is required for multi-node scalability. Ensure the system design accommodates the 9.6 V to 61.6 V operating voltage range and supports the necessary SPI or TPL interface protocols.
The MC33771B series belongs to NXP's SafeAssure portfolio, providing long-term supply availability for critical infrastructure. It is part of a broader BMS ecosystem that includes the MC33664 transceiver and MPC5xxx microcontrollers. This family is engineered to reduce bill-of-materials costs while maintaining high functional safety integrity for electric mobility and grid storage applications.
The MC33771CTP2AE is a documented alternative within the same product family, offering similar channel counts and functionality. Verify pinout compatibility and software configuration requirements when substituting between B and C series variants. Consult NXP documentation for specific differences in packaging or thermal characteristics.