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MC33790HEG is listed in the Sensor And Detector Interfaces range at ChipApex. The manufacturer field lists NXP Semiconductors. Its product description is IC DIST SYST INTERFACE 16SOIC. Review the specifications below when checking this part for your BOM.
The MC33790HEG is a dual-channel Distributed System Interface (DSI) physical layer interface IC designed for automotive and industrial applications. It supports bidirectional communication between master and slave devices using SMARTMOS technology. The device operates with a logic supply voltage (VDD) of 4.75 V to 5.25 V and a bus supply voltage (VSUP) ranging from 8.0 V to 25.0 V. It features independent thermal shutdown and current limits, an on-board charge pump, and 2.0 kV ESD capability. Communications rates reach up to 150 kbps, with internal pull-ups and pull-downs on logic inputs.
Verify the specific ordering suffix against the manufacturer's official documentation to confirm package type and environmental compliance. The EG suffix indicates a lead-free package compliant with RoHS standards. Confirm the operating temperature range matches the application requirements before procurement.
Select this component when a dual-channel DSI physical layer interface is required for automotive or industrial networks. Ensure the system design accommodates the specified VSUP range and provides adequate heat dissipation given the thermal shutdown characteristics. Verify that the microcontroller interface logic levels are compatible with the device's input thresholds.
The MC33790 is part of NXP Semiconductors' (formerly Freescale) portfolio of analog integrated circuits focused on distributed system interfaces. It utilizes SMARTMOS technology to provide robust bus driving capabilities. This device serves as a critical link between standard logic levels and the higher voltage/current requirements of DSI bus networks in complex electronic architectures.
MC33790DW
The CPCAP pin is used to store and filter the output of the on-board charge pump, acting as a charge reservoir for the gate drive.
The device includes independent thermal shutdown circuitry for each channel. If the junction temperature exceeds approximately 160°C to 170°C, the output drivers are disabled until the temperature drops below approximately 155°C.
Internal pull-ups are provided on the DSIxF pins and pull-downs on the DSIxS pins. If these pins are left unconnected, the associated DSI bus enters a high-impedance state.
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