Power Management - Specialized MC33909Q3ADR2 product image

MC33909Q3ADR2

  • Description:SBC 3V 1CAN 0LIN 6SG HLQFP48
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:d20689f837d8 Category: Brand:

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MC33909Q3ADR2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SBC 3V 1CAN 0LIN 6SG HLQFP48. Review the specifications below when checking this part for your BOM.

Power Management - Specialized specifications for MC33909Q3ADR2

  • Description:SBC 3V 1CAN 0LIN 6SG HLQFP48
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Applications:System Basis Chip
  • Current - Supply:7mA
  • Voltage - Supply:3.5V ~ 28V
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:48-LQFP Exposed Pad
  • Supplier Device Package:48-LQFP-EP (7x7)
  • Grade:-
  • Qualification:-

Power Management - Specialized datasheet and documents for MC33909Q3ADR2

MC33909Q3ADR2

Power Management - Specialized Overview

The MC33909Q3ADR2 is a System Basis Chip (SBC) from NXP Semiconductors, belonging to the second-generation family of devices that integrate multiple functions into a single module. It is housed in a 48-LQFP-EP package with dimensions of 7x7 mm. This component combines power management and connectivity features, designed to enhance existing module designs by reducing board space and complexity. The device supports automotive applications requiring robust system integration.

Power Management - Specialized Feature Summary

  • Integrates multiple system functions into a single chip to reduce design complexity
  • Part of the second-generation System Basis Chip family for enhanced performance
  • Utilizes a compact 48-LQFP-EP package for efficient board layout

Power Management - Specialized Applications

  • Automotive electronic control units
  • System basis chip implementations
  • Integrated power and connectivity modules

Power Management - Specialized Procurement Notes

Verify the specific ordering suffix 'ADR2' against the official NXP datasheet to confirm package type and temperature range. Note that this part may be subject to End-of-Life status as indicated by public product change notices. Ensure compatibility with current design requirements before procurement.

Power Management - Specialized Selection Notes

Select this component when a consolidated solution for power management and communication interfaces is required within automotive constraints. Consider the 48-LQFP-EP package size for thermal and spatial limitations. Validate that the integrated features meet the specific voltage and interface needs of the target application without requiring external components.

Power Management - Specialized Part Context

This SBC belongs to the MC33903/4/5 family, representing the second generation of NXP's System Basis Chips. These devices are engineered to combine various functionalities, offering an evolution over previous generations by enhancing module designs through greater integration and improved efficiency for automotive systems.

Power Management - Specialized Replacement Considerations

Check for direct substitutes within the MC33903/4/5 family or updated revisions from NXP. Verify pin-to-pin compatibility and functional equivalence if replacing due to availability issues.

MC33909Q3ADR2MC33909Q3ADR2

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