— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC PWR SWITCH N-CHAN 1:1 16QFN
- Series:-
- Mfr:NXP USA Inc.
- Package:Tape & Reel (TR),Cut Tape (CT)
- Switch Type:General Purpose
- Number of Outputs:1
- Ratio - Input:Output:1:01
- Output Configuration:High Side
- Output Type:N-Channel
- Interface:PWM
- Voltage - Load:6V ~ 27V
- Voltage - Supply (Vcc/Vdd):-
- Current - Output (Max):40A
- Rds On (Typ):4mOhm
- Input Type:-
- Features:Slew Rate Controlled
- Fault Protection:Current Limiting (Fixed), Over Temperature
- Operating Temperature:-40°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Supplier Device Package:16-PQFN (12x12)
- Package / Case:16-PowerQFN
- Grade:-
- Qualification:-
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Overview
The MC33981BHFKR2 is a System Basis Chip (SBC) designed for automotive applications, integrating an ARM Cortex-M0+ microcontroller core with power management and communication interfaces. It features a 5V low-dropout regulator, a LIN transceiver compliant with LIN 2.x standards, and multiple high-side and low-side switches for load driving. The device includes comprehensive diagnostic capabilities via SPI, a configurable window watchdog timer, and protection mechanisms such as over-current, over-temperature, and undervoltage lockout. It supports various operating modes including normal, sleep, and stop to optimize power consumption while maintaining connectivity through LIN and wake-up inputs.
Feature Summary
- Integrated ARM Cortex-M0+ microcontroller core for local processing and control logic
- Built-in LIN transceiver supporting LIN 2.0 and 2.1 protocol specifications
- Multiple switched outputs including high-side and low-side drivers with fault protection
- Comprehensive diagnostic interface via full-duplex SPI with readable status registers
Applications
- Automotive body control modules
- Door control units
- Seat adjustment systems
- Lighting control modules
Procurement Notes
Verify the specific suffix 'HFKR2' against official NXP documentation to confirm package type, tape-and-reel quantity, and temperature grade. Ensure compatibility with existing PCB footprints and thermal requirements. Confirm that the integrated MCU core meets the functional safety integrity level required for the target application. Check for any recent lifecycle notices or obsolescence warnings directly from the manufacturer before finalizing procurement plans.
Selection Notes
Select this component when a combined solution of power distribution, LIN communication, and local MCU processing is required to reduce bill-of-materials count. It is suitable for applications needing isolated control of multiple loads with real-time diagnostics. Consider the available memory and peripheral resources of the embedded Cortex-M0+ core against application complexity. Evaluate the thermal performance of the chosen package variant under maximum load conditions to ensure reliable operation within the specified automotive temperature range.
Part Context
The MC33981 belongs to NXP's SBC portfolio, which integrates standard system functions into a single chip to simplify automotive electronic architecture. These devices typically replace discrete components like voltage regulators, transceivers, and switch drivers. The integration of an MCU core distinguishes it from simpler SBCs, allowing for more complex local decision-making without requiring a separate main processor for basic functions. This trend supports modular design strategies in modern vehicle electronics.
Replacement Considerations
Consult official NXP substitution guides for verified alternatives. Cross-reference pinouts and electrical characteristics carefully if considering competitors. Ensure any substitute maintains the same LIN protocol compliance and MCU core compatibility if software reuse is intended.
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