Power Management - Specialized MC33FS4502NAE product image

MC33FS4502NAE

$4.30
  • Description:SYSTEM BASIS CHIP LINEAR 0.5A V
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:e88c3a295f19 Category: Brand:

  
  • Quantity
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MC33FS4502NAE is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP LINEAR 0.5A V. Review the specifications below when checking this part for your BOM.

Power Management - Specialized specifications for MC33FS4502NAE

  • Description:SYSTEM BASIS CHIP LINEAR 0.5A V
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Applications:System Basis Chip
  • Current - Supply:-
  • Voltage - Supply:1V ~ 5V
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:48-LQFP Exposed Pad
  • Supplier Device Package:48-HLQFP (7x7)
  • Grade:-
  • Qualification:-

Power Management - Specialized datasheet and documents for MC33FS4502NAE

MC33FS4502NAE

Power Management - Specialized Overview

The MC33FS4502NAE is a System Basis Chip (SBC) from NXP Semiconductors designed for power train applications. It integrates a linear 0.5 A Vcore regulator, LDT, and CAN interface within an HLQFP48 package. The device operates with a supply voltage range of 1V to 5V and functions reliably across an extended temperature range of -40°C to +125°C. This component serves as a specialized PMIC solution, combining essential power management and communication capabilities in a single compact form factor suitable for automotive systems.

Power Management - Specialized Feature Summary

  • Integrates a linear 0.5 A Vcore regulator for efficient voltage control
  • Includes built-in Local Data Terminal (LDT) functionality
  • Features integrated CAN interface for robust communication
  • Designed specifically for power train system applications

Power Management - Specialized Applications

  • Power train systems
  • Automotive electronic control units
  • System basis chip implementations requiring integrated power and communication

Power Management - Specialized Procurement Notes

Verify the exact ordering suffix against the manufacturer's current datasheet to ensure correct package and tape/reel specifications. Confirm RoHS compliance status and moisture sensitivity level requirements prior to procurement. Ensure the selected variant matches the specific thermal and electrical requirements of the target application design.

Power Management - Specialized Selection Notes

Select this component when a combined power management and CAN communication solution is required for automotive power trains. Consider the 0.5 A Vcore capability and HLQFP48 package constraints during PCB layout. Verify that the operating temperature range meets the environmental conditions of the intended installation site.

Power Management - Specialized Part Context

This part belongs to the FS4500 series of System Basis Chips from NXP Semiconductors. These devices are engineered to simplify automotive electronics by integrating multiple power rails and communication interfaces into a single package, reducing board space and component count compared to discrete solutions.

Power Management - Specialized Replacement Considerations

Check the MC33FS4500NAE and MC33FS4502CAER2 for potential pin-compatible or functionally similar alternatives within the same family. Verify package dimensions and electrical characteristics before substitution.

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