Power Management - Specialized MC33FS4505LAE product image

MC33FS4505LAE

$6.54
  • Description:SYSTEM BASIS CHIP, LINEAR 0.5A V
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:f183b1060adb Category: Brand:

  
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MC33FS4505LAE is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP, LINEAR 0.5A V. Review the specifications below when checking this part for your BOM.

Power Management - Specialized specifications for MC33FS4505LAE

  • Description:SYSTEM BASIS CHIP, LINEAR 0.5A V
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Applications:System Basis Chip
  • Current - Supply:-
  • Voltage - Supply:1V ~ 5V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-LQFP Exposed Pad
  • Supplier Device Package:48-HLQFP (7x7)
  • Grade:Automotive
  • Qualification:AEC-Q100

Power Management - Specialized datasheet and documents for MC33FS4505LAE

MC33FS4505LAE

Power Management - Specialized Overview

The MC33FS4505LAE is a System Basis Chip (SBC) from NXP Semiconductors designed for automotive power management. It integrates a DC/DC pre-regulator and linear regulators to supply power to Microcontroller Units (MCUs). The device features a linear regulator capable of delivering up to 0.5A output current. It operates within an input voltage range starting at 2.7V and supports a wide operating temperature range from -40°C to 125°C. The component is housed in a 48-LQFP package with exposed pad, suitable for surface-mount installation.

Power Management - Specialized Feature Summary

  • Integrates DC/DC pre-regulator and linear regulators for optimized energy consumption
  • Provides dedicated power supply capabilities for connected MCUs
  • Designed specifically for automotive power train applications

Power Management - Specialized Applications

  • Automotive power train systems
  • Microcontroller Unit (MCU) power supply
  • System basis chip implementations in automotive electronics

Power Management - Specialized Procurement Notes

Verify the exact suffix 'LAE' against the manufacturer's official datasheet to confirm pinout and functional specifications, as suffixes often denote specific packaging or temperature grades. Ensure compatibility with your PCB footprint, specifically the 48-LQEP package dimensions. Confirm RoHS compliance status through the latest production documentation before finalizing procurement orders.

Power Management - Specialized Selection Notes

Select this component when a consolidated solution for MCU power regulation and system monitoring is required in automotive environments. It is suitable for designs needing integrated linear regulation with low noise characteristics. Consider the thermal performance of the LQFP package and ensure adequate board space for the exposed pad connection to maintain reliable operation under high ambient temperatures.

Power Management - Specialized Part Context

This part belongs to the FS45 series of System Basis Chips from NXP Semiconductors. These devices are engineered to simplify the design of complex automotive electronic control units by combining power management and communication interfaces into a single compact package. The series targets applications requiring robust power delivery and efficient energy management in harsh automotive conditions.

Power Management - Specialized Replacement Considerations

Consult the official NXP FSx500 datasheet for confirmed substitute part numbers. Verify electrical compatibility and pin-to-pin equivalence before considering alternatives such as other variants within the MC33FS45xx family.

MC33FS4505LAEMC33FS4505LAE
$6.54
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