Power Management - Specialized MC33FS4506CAE product image

MC33FS4506CAE

$4.30
  • Description:SYSTEM BASIS CHIP, LINEAR 0.5A V
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:21e2a425a27e Category: Brand:

  
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MC33FS4506CAE is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP, LINEAR 0.5A V. Review the specifications below when checking this part for your BOM.

Power Management - Specialized specifications for MC33FS4506CAE

  • Description:SYSTEM BASIS CHIP, LINEAR 0.5A V
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Applications:System Basis Chip
  • Current - Supply:-
  • Voltage - Supply:1V ~ 5V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-LQFP Exposed Pad
  • Supplier Device Package:48-HLQFP (7x7)
  • Grade:Automotive
  • Qualification:AEC-Q100

Power Management - Specialized datasheet and documents for MC33FS4506CAE

MC33FS4506CAE

Power Management - Specialized Overview

The MC33FS4506CAE is a System Basis Chip (SBC) from NXP Semiconductors, designed for automotive power management applications. It integrates a high-performance microcontroller unit with integrated CAN FD and LIN transceivers, alongside multiple linear voltage regulators. The device operates within an input voltage range of 2.7 V to 40 V and supports output voltages from 1 V to 5 V. It features a 500 mA output current capability and functions reliably across an extended temperature range of -40°C to +125°C. The component is housed in a 48-LQFP package with exposed pad, suitable for surface mount installation.

Power Management - Specialized Feature Summary

  • Integrates a robust microcontroller unit with built-in CAN FD and LIN communication interfaces for seamless network connectivity.
  • Provides multiple regulated voltage outputs via linear regulators to support diverse onboard electronic loads.
  • Engineered for high reliability in harsh automotive environments with wide operating temperature tolerance.

Power Management - Specialized Applications

  • Automotive powertrain control modules
  • Body control modules requiring integrated communication
  • Safety-critical automotive electronic systems

Power Management - Specialized Procurement Notes

Verify the exact suffix 'CAE' against the manufacturer's official datasheet to confirm pinout and feature set compatibility. Ensure the procurement channel provides valid RoHS compliance documentation. Confirm that the 48-LQFP package dimensions match your PCB footprint requirements before finalizing orders.

Power Management - Specialized Selection Notes

Select this component when a combined solution of MCU processing and isolated communication transceivers is required. It is suitable for designs needing integrated CAN FD and LIN capabilities without external transceiver components. Consider the thermal performance of the LQFP package with exposed pad for adequate heat dissipation in enclosed automotive enclosures.

Power Management - Specialized Part Context

This part belongs to the FS4500 series of System Basis Chips from NXP Semiconductors. These devices are specifically engineered for automotive applications, combining power management and microcontroller functionalities into a single compact package. The series is designed to reduce board space and simplify system architecture in modern vehicles.

Power Management - Specialized Replacement Considerations

Consult the official NXP FS4500 family cross-reference guide for verified substitutes. Direct replacements must maintain identical pinouts and functional specifications to ensure compatibility with existing hardware designs.

MC33FS4506CAEMC33FS4506CAE
$4.30
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