Power Management - Specialized MC33FS6501NAE product image

MC33FS6501NAE

$4.24
  • Description:SYSTEM BASIS CHIP DCDC 0.8A VCO
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:1c18471e64b7 Category: Brand:

  
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MC33FS6501NAE is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP DCDC 0.8A VCO. Review the specifications below when checking this part for your BOM.

Power Management - Specialized specifications for MC33FS6501NAE

  • Description:SYSTEM BASIS CHIP DCDC 0.8A VCO
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Applications:System Basis Chip
  • Current - Supply:-
  • Voltage - Supply:1V ~ 5V
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:48-LQFP Exposed Pad
  • Supplier Device Package:48-HLQFP (7x7)
  • Grade:-
  • Qualification:-

Power Management - Specialized datasheet and documents for MC33FS6501NAE

MC33FS6501NAE

Power Management - Specialized Overview

The MC33FS6501NAE is a System Basis Chip (SBC) from the FS6500 series, designed for automotive applications. It integrates DC-DC switching regulators and linear regulators to power MCUs while optimizing energy consumption. The device supports ASIL B/D safety requirements and includes integrated CAN FD and LIN physical interfaces compliant with ISO11898 and LIN standards. It operates within an input voltage range of 2.7 V to 40 V and provides output voltages from 1 V to 5 V. The MCU core supply current reaches 0.8 A via SMPS or 0.5 A via LDO. Operating temperatures span -40°C to +125°C, with high-temperature tolerance up to TA=150°C and TJ=175°C per AEC-Q100 Grade 0.

Power Management - Specialized Feature Summary

  • Integrates advanced functional safety features including critical analog parameter monitoring, a fail-safe state machine, and an advanced watchdog to reduce software complexity for dual-core lockstep MCUs.
  • Features highly flexible SMPS pre-regulators supporting non-inverting buck-boost and standard buck topologies for efficient power conversion.
  • Includes integrated CAN FD and LIN physical interfaces meeting latest automotive OEM EMC and ESD standards alongside serial peripheral interface (SPI) for MCU control and diagnostics.

Power Management - Specialized Applications

  • Power Train systems
  • ASIL B/D ready automotive electronic control units
  • MCU power management in harsh environment vehicles

Power Management - Specialized Procurement Notes

Verify the specific suffix 'NAE' corresponds to the LQFP-48EP package and Grade 0 temperature rating. Confirm RoHS compliance status through official NXP documentation. Ensure design compatibility with the FS6500 family pinout and electrical characteristics before integration.

Power Management - Specialized Selection Notes

Select this component when ASIL B/D readiness and high-temperature operation are required. Compare against other FS6500 variants based on required output current capabilities and specific interface needs. Verify that the 0.8A SMPS output meets the target MCU core power demands.

Power Management - Specialized Part Context

Part of the FS6500 System Basis Chip family, which consolidates power management and communication interfaces into a single solution. This series targets automotive ECUs requiring high reliability and functional safety certification.

Power Management - Specialized Replacement Considerations

Consult NXP datasheets for direct substitutes within the MC33FS650x series. Verify pin compatibility and thermal performance when considering alternatives like the MC33FS6500 or MC33FS6505 variants.

Power Management - Specialized FAQ

What is the maximum junction temperature for the MC33FS6501NAE?

The device is rated for a maximum junction temperature (TJ) of 175°C, complying with AEC-Q100 Grade 0 standards.

Does the MC33FS6501NAE support CAN FD?

Yes, it integrates a CAN FD physical interface compliant with ISO11898-2 and ISO11898-5 standards.

MC33FS6501NAEMC33FS6501NAE
$4.24
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