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MC33FS6502NAE is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP DCDC 0.8A VCO. Review the specifications below when checking this part for your BOM.
The MC33FS6502NAE is a System Basis Chip (SBC) from NXP Semiconductors designed for automotive applications. It integrates DC-DC switching regulators, linear regulators, and communication interfaces to power microcontrollers while optimizing energy consumption. The device features a 0.8 A Vcore SMPS and supports LDT functionality. It includes integrated CAN FD and LIN physical interfaces compliant with ISO11898-2, -5, and LIN 2.2 standards. The component is housed in an LQFP48EP package and meets AEC-Q100 Grade 1 automotive standards.
Verify the specific suffix 'NAE' against the official NXP datasheet to confirm pinout, thermal characteristics, and compliance status. Ensure compatibility with your system's voltage requirements and communication protocols before integration. Cross-reference ordering information with authorized distributors to avoid counterfeit components.
Select this component when a combined power management and communication interface solution is required for automotive ECUs. It is appropriate for designs needing integrated CAN FD and LIN support alongside efficient MCU core power regulation. Consider the 0.8 A current capability and package thermal performance relative to your board layout constraints.
This part belongs to the FS65 series of System Basis Chips from NXP Semiconductors. The series is engineered to provide comprehensive power management and connectivity for microcontrollers in demanding automotive environments. These devices consolidate multiple functions into a single package to reduce board space and simplify design complexity.
Consult NXP documentation for direct substitutes within the FS65 family, such as variants with different current ratings or interface options. Verify that any replacement maintains the required ASIL level, package type, and electrical specifications.
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