Power Management - Specialized MC33FS6503CAER2 product image

MC33FS6503CAER2

$5.01
  • Description:SYSTEM BASIS CHIP DCDC 0.8A VCO
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:a7b87e6a4691 Category: Brand:

  
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MC33FS6503CAER2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP DCDC 0.8A VCO. Review the specifications below when checking this part for your BOM.

Power Management - Specialized specifications for MC33FS6503CAER2

  • Description:SYSTEM BASIS CHIP DCDC 0.8A VCO
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Applications:System Basis Chip
  • Current - Supply:-
  • Voltage - Supply:1V ~ 5V
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:48-LQFP Exposed Pad
  • Supplier Device Package:48-HLQFP (7x7)
  • Grade:-
  • Qualification:-

Power Management - Specialized datasheet and documents for MC33FS6503CAER2

MC33FS6503CAER2

Power Management - Specialized Overview

The MC33FS6503CAER2 is an automotive-grade System Basis Chip (SBC) from the FS6500 series, designed for safety-critical powertrain applications. It integrates a high-performance 32-bit MCU with multiple voltage regulators and communication interfaces. Key electrical parameters include a Vcore DCDC output current of 0.8A, an operating supply voltage range of 2.7V to 40V, and regulated output voltages between 1V and 5V. The device operates within a temperature range of -40°C to +125°C and is housed in a 48-pin LQFP-EP package.

Power Management - Specialized Feature Summary

  • Integrates a 32-bit MCU core with dedicated safety mechanisms for functional safety compliance
  • Includes integrated DCDC converters providing high-current Vcore regulation
  • Features built-in CAN transceiver and diagnostic capabilities for robust vehicle communication
  • Supports comprehensive system monitoring including voltage, temperature, and clock supervision

Power Management - Specialized Applications

  • Automotive powertrain control units
  • Safety-critical engine management systems
  • Transmission control modules requiring ISO 26262 compliance

Power Management - Specialized Procurement Notes

Verify the specific suffix 'R2' indicates tape-and-reel packaging configuration compared to tray options. Confirm RoHS compliance status through official NXP documentation prior to integration. Ensure ESD handling protocols are followed due to moisture sensitivity classification. Cross-reference pinout diagrams with target PCB layout requirements to avoid interface mismatches during assembly.

Power Management - Specialized Selection Notes

Select this component when a combined MCU and power management solution is required for space-constrained automotive designs. Evaluate thermal performance under maximum load conditions given the integrated DCDC architecture. Consider the specific voltage regulator outputs needed versus available channels to ensure adequate headroom for peripheral loads. Verify that the 48-pin package footprint aligns with existing manufacturing capabilities.

Power Management - Specialized Part Context

This part belongs to the NXP FS6500 family of System Basis Chips, which combine microcontroller functionality with power management and communication interfaces. These devices are engineered specifically for automotive environments, offering integrated solutions that reduce bill-of-materials count and board space while maintaining high reliability standards for critical vehicle subsystems.

Power Management - Specialized Replacement Considerations

Check for direct substitutes within the FS6500 series such as MC33FS6503CAE for tray packaging variants. Verify pin-to-pin compatibility if considering alternative SBC families from other manufacturers. Ensure software drivers and peripheral configurations remain compatible with any upgraded or legacy MCU cores.

MC33FS6503CAER2MC33FS6503CAER2
$5.01
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