Power Management - Specialized MC33FS6505LAE product image

MC33FS6505LAE

$6.66
  • Description:SYSTEM BASIS CHIP, DCDC 0.8A VCO
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:fab0e4d49e7e Category: Brand:

  
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MC33FS6505LAE is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP, DCDC 0.8A VCO. Review the specifications below when checking this part for your BOM.

Power Management - Specialized specifications for MC33FS6505LAE

  • Description:SYSTEM BASIS CHIP, DCDC 0.8A VCO
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Applications:System Basis Chip
  • Current - Supply:-
  • Voltage - Supply:1V ~ 5V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-LQFP Exposed Pad
  • Supplier Device Package:48-HLQFP (7x7)
  • Grade:Automotive
  • Qualification:AEC-Q100

Power Management - Specialized datasheet and documents for MC33FS6505LAE

MC33FS6505LAE

Power Management - Specialized Overview

The MC33FS6505LAE is a System Basis Chip (SBC) from NXP Semiconductors designed for automotive applications. It integrates power management and communication interfaces to support Microcontroller Unit (MCU) operation. The device features a DC/DC switch-mode power supply with a maximum output current of 0.8A, providing efficient voltage regulation for the MCU core. It includes integrated CAN FD and LIN physical layer transceivers compliant with ISO11898-2 and LIN standards. The component supports advanced safety mechanisms suitable for ASIL B/D applications, including critical analog parameter monitoring and a fail-safe state machine.

Power Management - Specialized Feature Summary

  • Integrates high-performance DC/DC switching regulator for efficient MCU core power delivery
  • Includes built-in CAN FD and LIN physical interface controllers for robust vehicle network communication
  • Supports advanced functional safety requirements with integrated fault detection and monitoring systems

Power Management - Specialized Applications

  • Automotive microcontroller power management in ASIL B/D environments
  • Body control modules requiring integrated CAN FD connectivity
  • Sensor nodes needing low-power standby modes with wake-up capabilities

Power Management - Specialized Procurement Notes

Verify that the specific suffix 'LAE' corresponds to the intended package type and temperature grade as defined in the official NXP datasheet. Confirm compliance with AEC-Q100 Grade 1 or 0 specifications required by your design. Ensure the ordering part number matches the exact pinout and feature set documented in the manufacturer's product specification before finalizing procurement.

Power Management - Specialized Selection Notes

Select this component when designing systems requiring an integrated solution for both power regulation and serial communication interfaces. It is appropriate for applications demanding high reliability and functional safety certification. Consider the 0.8A output capability of the DC/DC converter against the peak current requirements of the target MCU. Evaluate the thermal performance within the 48-HLQFP package for the expected ambient operating conditions.

Power Management - Specialized Part Context

This SBC belongs to the FS6500 family of system basis chips developed for automotive electronics. The family provides scalable solutions for various MCU architectures, combining power supplies with communication peripherals. The MC33FS6505LAE variant specifically targets applications needing CAN FD support alongside efficient power management, serving as a central node controller in modern vehicle networks.

Power Management - Specialized Replacement Considerations

Consult the NXP FS6500 family cross-reference guide for compatible alternatives. Verify pin-to-pin compatibility and electrical parameter alignment with existing designs before substituting.

MC33FS6505LAEMC33FS6505LAE
$6.66
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