MC33FS6507LAER2

Power Management - Specialized Overview

The MC33FS6507LAER2 is a System Basis Chip (SBC) from NXP Semiconductors designed for automotive applications. It integrates power management and communication interfaces within an LQFP-48EP package. The device supports an input voltage range of 2.7 V to 40 V, with output voltages adjustable from 1 V to 5 V. It features a DC/DC converter capable of delivering up to 0.8 A for MCU core supply. Operating temperatures span from -40°C to 125°C (TA). The component includes integrated CAN FD and LIN physical interfaces compliant with ISO11898-2, -5, and LIN standards.

Power Management - Specialized Feature Summary

• Integrates CAN FD and LIN physical interfaces compliant with automotive OEM EMC and ESD standards
• Includes advanced functional safety measures suitable for ASIL B/D applications
• Features a highly flexible SMPS pre-regulator supporting non-inverting buck-boost and standard buck topologies
• Provides multiple low-power wake-up sources including CAN, LIN, I/O, and Long Duration Timer

Power Management - Specialized Applications

• Power Train systems
• MCU power supply and control in automotive electronics
• ASIL B/D certified safety-critical embedded designs

Power Management - Specialized Procurement Notes

Verify the specific ordering suffix against the official NXP datasheet to confirm pinout compatibility and thermal grade. Ensure the procurement channel provides valid traceability documentation for automotive-grade components. Confirm that the received units match the active part status and RoHS compliance details specified in the manufacturer's current product data sheet before integration into production lines.

Power Management - Specialized Selection Notes

Select this component when designing systems requiring integrated CAN FD and LIN connectivity alongside robust power management. It is appropriate for applications demanding ASIL B/D functional safety certification. Consider the 0.8 A DC/DC output capability for MCU core powering needs. Evaluate the operating temperature range and package type against the target environmental constraints and PCB layout requirements.

Power Management - Specialized Part Context

This part belongs to the FS6500 family of System Basis Chips, which are designed to provide efficient power management and communication capabilities for microcontrollers in automotive environments. The family offers various configurations tailored for different safety integrity levels and thermal performance requirements, ensuring stability through long-term supply plans.

Power Management - Specialized Replacement Considerations

Consult the official NXP FS6500 product plan for confirmed substitute part numbers. Verify cross-compatibility regarding pin assignments, electrical characteristics, and safety certifications before substituting.