Power Management - Specialized MC33FS6507NAER2 product image

MC33FS6507NAER2

$3.80
  • Description:SYSTEM BASIS CHIP, DCDC 0.8A VCO
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:0f04506bd133 Category: Brand:

  
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MC33FS6507NAER2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP, DCDC 0.8A VCO. Review the specifications below when checking this part for your BOM.

Power Management - Specialized specifications for MC33FS6507NAER2

  • Description:SYSTEM BASIS CHIP, DCDC 0.8A VCO
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Applications:System Basis Chip
  • Current - Supply:-
  • Voltage - Supply:1V ~ 5V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-LQFP Exposed Pad
  • Supplier Device Package:48-HLQFP (7x7)
  • Grade:Automotive
  • Qualification:AEC-Q100

Power Management - Specialized datasheet and documents for MC33FS6507NAER2

MC33FS6507NAER2

Power Management - Specialized Overview

The MC33FS6507NAER2 is a System Basis Chip (SBC) from NXP Semiconductors, designed for automotive applications. It integrates power management and communication interfaces. The device features a DCDC converter with a 0.8A Vcore output capability. It is housed in a 48-HLQFP package measuring 7x7 mm. The operating supply voltage range is specified as 1V to 5V. This component belongs to the FS65 family, which is scalable and robust for vehicle electrification trends.

Power Management - Specialized Feature Summary

  • Integrates system basis chip functionality combining power management and communication interfaces
  • Includes a DCDC converter providing regulated core voltage support
  • Designed specifically for automotive grade reliability and vehicle electrification applications

Power Management - Specialized Applications

  • Automotive system basis chip implementations
  • Vehicle electrification control units
  • Power management modules requiring integrated communication

Power Management - Specialized Procurement Notes

Verify the exact part number suffix against official NXP documentation to ensure correct pinout and feature set. Confirm automotive qualification status and RoHS compliance requirements prior to procurement. Check for any specific ordering suffixes that may indicate packaging variations or temperature grades. Ensure compatibility with existing board designs regarding the 48-HLQFP footprint.

Power Management - Specialized Selection Notes

Select this component when an integrated solution for automotive power management and communication is required. Consider the FS65 family scalability if future product variants are planned. Evaluate the 0.8A Vcore capability against processor power requirements. Verify the 48-HLQFP package dimensions fit within the mechanical constraints of the target application enclosure.

Power Management - Specialized Part Context

This component is part of the NXP FS65 series of System Basis Chips. These chips are engineered for robustness and scalability in modern automotive architectures. The series supports various communication protocols and power configurations tailored for electric and hybrid vehicle systems. The MC33FS6507NAER2 represents a specific configuration within this scalable family.

Power Management - Specialized Replacement Considerations

Consult NXP datasheets for direct cross-references within the FS65 series. Verify pin-to-pin compatibility before substituting with other SBC models. Ensure functional equivalence in communication interface support and power delivery specifications.

MC33FS6507NAER2MC33FS6507NAER2
$3.80
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