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MC33FS6512LAER2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP DCDC 1.5A VCO. Review the specifications below when checking this part for your BOM.
The MC33FS6512LAER2 is a System Basis Chip (SBC) from NXP USA Inc., designed for automotive applications. It integrates power management and communication interfaces within a 48-HLQFP package. The device supports an input voltage range of 1V to 5V for internal regulation and operates across a temperature range of -40°C to 125°C. It features a DC/DC converter capable of delivering 1.5A for the MCU core, alongside linear regulators. The component complies with AEC-Q100 Grade 1 standards and includes integrated CAN FD and LIN physical interfaces.
Verify the complete part number including suffixes such as LAER2 against official NXP documentation to ensure correct package type and tape/reel specifications. Confirm RoHS compliance status and moisture sensitivity level requirements prior to ordering. Cross-reference the datasheet revision date to validate feature availability and electrical characteristics match your design specifications exactly.
Select this component when a combined power management and serial communication solution is required for automotive ECUs. It is appropriate for designs needing a 1.5A core supply via DC/DC conversion. Consider its ASIL readiness if functional safety certification is mandated. Ensure the 48-pin HLQFP footprint fits the PCB layout constraints and that the operating temperature range meets the specific environmental conditions of the target application.
This SBC belongs to the FS6500 family, which provides integrated power and communication capabilities for microcontrollers. The family variants differ primarily in output current ratings and specific safety features. The MC33FS6512LAER2 specifically offers a 1.5A DC/DC output, distinguishing it from lower-current LDO-only or lower-amperage counterparts within the same series.
Check NXP's official product change notification lists for direct substitutes. Verify pin-to-pin compatibility with existing designs before swapping components. Ensure any alternative maintains the same AEC-Q100 grade and communication interface standards.
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