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MC33FS6513NAER2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP DCDC 1.5A VCO. Review the specifications below when checking this part for your BOM.
The MC33FS6513NAER2 is a System Basis Chip (SBC) from NXP Semiconductors designed for automotive applications. It integrates power management functions including DC-DC switching regulators and linear regulators to supply power to microcontrollers while optimizing energy consumption. The device features an integrated DC-DC converter capable of delivering up to 1.5A for Vcore applications. It supports low-power saving modes and is housed in a 48-HLQFP package with dimensions of 7x7 mm.
Verify the exact part number suffix, as 'R2' typically denotes tape and reel packaging which may differ from tray-packaged equivalents like the MC33FS6513NAE. Confirm RoHS compliance and REACH directive adherence with the supplier. Ensure the ordering quantity matches the specific packaging configuration required for your assembly process. Cross-reference the datasheet revision date to ensure compatibility with current design specifications.
Select this component when a compact SBC solution is required for automotive MCU power management. The integrated DC-DC capability reduces external component count compared to solutions using only LDOs. Consider the 48-pin HLQFP footprint for PCB layout constraints. Evaluate the thermal performance requirements given the 1.5A output capability of the internal regulator.
This component belongs to the NXP FS65 family of System Basis Chips. The FS65 series is designed to be scalable, robust, and highly reliable, addressing the increasing complexity of modern automotive electronics. These chips integrate multiple power rails and communication interfaces into a single package to save board space and improve system reliability.
The MC33FS6513NAE is a pin-compatible alternative available in tray packaging instead of tape and reel. Verify that the packaging difference does not impact automated assembly processes. Both parts share the same functional specifications and package outline.
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