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MC33FS6515CAE is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP, DCDC 1.5A VCO. Review the specifications below when checking this part for your BOM.
The MC33FS6515CAE is a System Basis Chip (SBC) from the FS6500 series, designed for automotive power train applications. It integrates a DC/DC switch-mode power supply delivering up to 1.5 A for MCU core voltage regulation, alongside linear regulators. The device supports CAN FD and LIN physical interfaces compliant with ISO11898-2 and LIN 2.2 standards. It operates within an ambient temperature range of -40°C to +125°C and is housed in a 48-pin LQFP package with an exposed pad.
Verify the specific suffix 'CAE' against the manufacturer's current datasheet to confirm pinout compatibility and functional specifications. Ensure the component meets the required AEC-Q100 grade for your target application environment. Cross-reference ordering information with official NXP documentation to avoid discrepancies between distributor listings and actual part capabilities.
Select this component when a 1.5 A core voltage capability is required for the host microcontroller. It is suitable for designs needing integrated CAN FD and LIN interfaces without external transceivers. Consider the thermal performance and ASIL B/D readiness if safety-critical functions are implemented. Verify that the 48-LQFP package fits the PCB layout constraints.
This part belongs to the NXP FS6500 family of System Basis Chips, which combine power management and communication interfaces. The FS6500 series is engineered for modern automotive architectures, offering high integration to reduce board space and complexity. It supports various topologies for input voltage conversion and provides flexible I/O configurations for system monitoring.
Consult the official NXP FS6500 product selection guide for verified pin-to-pin or functionally equivalent alternatives. Substitution requires validation of output current ratings, interface standards, and thermal characteristics against the original design specifications.
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